[EN] PRODUCTION OF CYCLIC IMIDES SUITABLE FOR OXIDATION CATALYSIS<br/>[FR] PRODUCTION D'IMIDES CYCLIQUES APPROPRIÉS POUR LA CATALYSE D'OXYDATION
申请人:EXXONMOBIL CHEMICAL PATENTS INC
公开号:WO2017204935A1
公开(公告)日:2017-11-30
Disclosed are novel processes for the production of cyclic imide compounds such as N-hydroxyphthalimide (NHPI). The processes may be particularly well-suited for commercial-scale production of cyclic imides such as NHPI. Such cyclic imide compounds are suitable for use as oxidation catalysts, and specifically may be used to oxidize cyclohexylbenzene to cyclohexyl-1-phenyl-1-hydroperoxide. Such an oxidation may be particularly useful in a process for the production of phenol and/or cyclohexanone from benzene via a process comprising hydroalkylation of benzene to cyclohexylbenzene, oxidation of the cyclohexylbenzene to cyclohexyl-1-phenyl-1-hydroperoxide, and cleavage of the cyclohexyl-1-phenyl-1-hydroperoxide to phenol and cyclohexanone. The cyclic imide production process may advantageously include water washing and reactant recovery steps to maximize purity and yield.
Cleaning composition, cleaning process, and process for producing semiconductor device
申请人:FUJIFILM Corporation
公开号:EP2305788A1
公开(公告)日:2011-04-06
A cleaning composition for removing plasma etching residue and/or ashing residue formed above a semiconductor substrate is provided that includes (component a) water, (component b) a hydroxylamine and/or a salt thereof, (component c) a basic organic compound, and (component d) an organic acid and has a pH of 7 to 9. There are also provided a cleaning process and a process for producing semiconductor device employing the cleaning composition.
Cleaning composition, method for producing semiconductor device, and cleaning method
申请人:Fujifilm Corporation
公开号:EP2386623A1
公开(公告)日:2011-11-16
Provided are a cleaning composition which is capable of inhibiting the metal of a semiconductor substrate from corrosion, and has an excellent removability of plasma etching residues and/or ashing residues on the semiconductor substrate, a method for producing a semiconductor device, and a cleaning method using the cleaning composition. The cleaning composition for removing plasma etching residues and/or ashing residues formed on a semiconductor substrate, and a preparation method and a cleaning method for a semiconductor device, using the cleaning composition, wherein the cleaning composition includes (Component a) water; (Component b) an amine compound; (Component c) hydroxylamine and/or a salt thereof; (Component d) a quaternary ammonium compound; (Component e) an organic acid; and (Component f) a water-soluble organic solvent; and has a pH of 6 to 9.
SOLUTION AND METHOD FOR REMOVAL OF GROUP III-V ELEMENT OXIDE, SOLUTION FOR TREATMENT OF GROUP III-V ELEMENT COMPOUND, SOLUTION FOR PREVENTING OXIDATION OF GROUP III-V ELEMENT, SOLUTION FOR TREATMENT OF SEMICONDUCTOR SUBSTRATE, AND METHOD FOR PRODUCTION OF SEMICONDUCTOR SUBSTRATE PRODUCT
申请人:Fujifilm Corporation
公开号:EP3258485A1
公开(公告)日:2017-12-20
Provided are a removal liquid for removing an oxide of a Group III-V element, an oxidation prevention liquid for preventing the oxidation of an oxide of a Group III-V element or a treatment liquid for treating an oxide of a Group III-V element, each liquid including an acid and a mercapto compound; and a method using each of the same liquids. Further provided are a treatment liquid for treating a semiconductor substrate, including an acid and a mercapto compound, and a method for producing a semiconductor substrate product using the same.
Production of cyclic imides suitable for oxidation catalysis
申请人:ExxonMobil Chemical Patents Inc.
公开号:US11014883B2
公开(公告)日:2021-05-25
Disclosed are novel processes for the production of cyclic imide compounds such as N-hydroxyphthalimide (NHPI). The processes may be particularly well-suited for commercial-scale production of cyclic imides such as NHPI. Such cyclic imide compounds are suitable for use as oxidation catalysts, and specifically may be used to oxidize cyclohexylbenzene to cyclohexyl-1-phenyl-1-hydroperoxide. Such an oxidation may be particularly useful in a process for the production of phenol and/or cyclohexanone from benzene via a process comprising hydroalkylation of benzene to cyclohexylbenzene, oxidation of the cyclohexylbenzene to cyclohexyl-1-phenyl-1-hydroperoxide, and cleavage of the cyclohexyl-1-phenyl-1-hydroperoxide to phenol and cyclohexanone. The cyclic imide production process may advantageously include water washing and reactant recovery steps to maximize purity and yield.