Electrolyte composition and treatment for electrolytic chemical mechanical polishing
申请人:——
公开号:US20030116446A1
公开(公告)日:2003-06-26
An electrolyte composition and method for planarizing a surface of a wafer using the electrolyte composition is provided. In one aspect, the electrolyte composition includes ammonium dihydrogen phosphate, diammonium hydrogen phosphate, or a mixture thereof. The composition has a pH between about 3 and about 10 which is environmentally friendly and does not present hazardous operation concerns. The composition may further comprise one or more additives selected from a group consisting of benzotriazole, ammonium citrate, ethlylenediamine, tetraethylenepentamine, triethylenetetramine, diethylenetriamine, amino acids, ammonium oxalate, ammonia, ammonium succinate, and citric acid.
提供了一种电解质组合物和使用该电解质组合物对晶片表面进行平面化处理的方法。在一个方面,电解质组合物包括磷酸二氢铵、磷酸氢二铵或它们的混合物。该组合物的 pH 值介于约 3 和约 10 之间,对环境友好,不会产生危险操作问题。该组合物可进一步包含一种或多种添加剂,这些添加剂选自由苯并三唑、柠檬酸铵、乙二胺、四乙烯五胺、三乙烯四胺、二乙烯三胺、氨基酸、草酸铵、氨、琥珀酸铵和柠檬酸组成的组。