1-异氰酸基-3-[(2-异氰酸基环己基)甲基]-2-甲基环己烷 | 80584-89-0

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并三唑类
• 中文名称: 1-异氰酸基-3-[(2-异氰酸基环己基)甲基]-2-甲基环己烷
• 中文别名: 水溶性铜缓蚀剂;2,2'-[[(甲基-1H-苯并三唑-1-基)甲基]亚氨基]双乙醇;2,2'-[[(甲基-1H-苯并三氮唑-1-基)甲基]氨基]双乙醇;水性铜缓蚀剂;水性铜缓蚀剂742；水性铜缓蚀剂；N-[(4-甲基-1H-苯并三唑-1-基)甲基]二乙醇胺；2,2'-氧基双(4,4,6-三甲基-1,3,2-二氧硼杂环/2,2'-((1-甲基-1,3-丙烷二基)双氧基))双(4-甲基-1,3,2-二氧硼杂环)；2,2'-[[(甲基-1H-苯并三氮唑-1-基)甲基]氨基]双乙醇；2,2'-氧基双(4,4,6-三甲基-1,3,2-二氧硼杂环
• 英文名称: 2,2'-[[(4-Methyl-1H-benzotriazol-1-YL)methyl]imino]bisethanol
• 英文别名: 2-[2-hydroxyethyl-[(4-methylbenzotriazol-1-yl)methyl]amino]ethanol
• CAS: 80584-89-0；88477-37-6
• 化学式: C₁₂H₁₈N₄O₂
• 分子量: 250.3
• InChiKey: ZUHDIDYOAZNPBV-UHFFFAOYSA-N

物化性质

• 沸点：
  488.2±35.0 °C(Predicted)
• 密度：
  1.29±0.1 g/cm3(Predicted)
• 物理描述：
  Liquid

计算性质

• 辛醇/水分配系数(LogP)：
  0.2
• 重原子数：
  18
• 可旋转键数：
  6
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.5
• 拓扑面积：
  74.4
• 氢给体数：
  2
• 氢受体数：
  5

文献信息

• Polishing composition and polishing method
  申请人：FUJIMI INCORPORATED

  公开号：EP2374852A1

  公开（公告）日：2011-10-12

  A polishing composition contains a polishing accelerator, a water-soluble polymer including a constitutional unit originating from a polymerizable compound having a guanidine structure such as dicyandiamide, and an oxidant. The water-soluble polymer may be a water-soluble polymer including a constitutional unit originating from dicyandiamide and a constitutional unit originating from formaldehyde, a diamine or a polyamine.

  一种抛光组合物含有一种抛光促进剂、一种水溶性聚合物（包括源自具有胍结构（如双氰胺）的可聚合化合物的构型单元）和一种氧化剂。水溶性聚合物可以是一种水溶性聚合物，包括源自双氰胺的构型单元和源自甲醛、二胺或多胺的构型单元。
• POLISHING COMPOSITION AND POLISHING METHOD
  申请人：Fujimi Incorporated

  公开号：EP2605270A1

  公开（公告）日：2013-06-19

  A polishing composition contains a water-soluble polymer, a polishing accelerator, and an oxidizing agent. The water-soluble polymer is a polyamide-polyamine polymer having an amine value of 150 mg KOH/1 g·solid or greater.

  一种抛光组合物含有一种水溶性聚合物、一种抛光促进剂和一种氧化剂。水溶性聚合物是一种聚酰胺-聚胺聚合物，其胺值为 150 毫克 KOH/1 克固体或更高。
• FOAM SHEET
  申请人：Nitto Denko Corporation

  公开号：EP3040369A1

  公开（公告）日：2016-07-06

  A foamed sheet according to the present invention has a thickness of 30 to 500 µm and includes a foam. The foam has a density of 0.2 to 0.7 g/cm3, an average cell diameter of 10 to 150 µm, and a peak top of loss tangent (tan δ) occurring in a temperature range of from -30°C to 30°C, where the loss tangent is defined as the ratio of a loss modulus to a storage modulus determined at an angular frequency of 1 rad/s in dynamic viscoelastic measurement of the foam. The foam preferably has a maximum of the loss tangent (tan δ) in the temperature range of from -30°C to 30°C of 0.2 or more.

  根据本发明，发泡片材的厚度为 30 至 500 微米，包括泡沫。泡沫的密度为 0.2 至 0.7 克/立方厘米，平均泡孔直径为 10 至 150 微米，损耗角正切（tan δ）的峰值出现在 -30°C 至 30°C 的温度范围内，其中损耗角正切被定义为泡沫动态粘弹性测量中在 1 弧度/秒的角频率下测定的损耗模量与存储模量之比。在-30°C 至 30°C的温度范围内，泡沫的损失正切（tan δ）最大值最好为 0.2 或以上。
• POLISHING COMPOSITION
  申请人：Fujimi Incorporated

  公开号：EP3053979A1

  公开（公告）日：2016-08-10

  The present invention provides a polishing composition having excellent storage stability. The present invention relates to a polishing composition including abrasive grains and an oxidant containing a halogen atom, a value (A/B) obtained by dividing the total number (A) (unit: number) of silanol groups contained in the abrasive grains in the polishing composition by a concentration (B) (unit: % by mass) of the oxidant in the polishing composition being 8 × 1023 or less.

  本发明提供了一种具有优异储存稳定性的抛光组合物。本发明涉及一种抛光组合物，其中包括研磨粒和含有卤素原子的氧化剂，将抛光组合物中研磨粒所含硅烷醇基团的总数（A）（单位：个）除以抛光组合物中氧化剂的浓度（B）（单位：质量百分比）得到的值（A/B）为 8 × 1023 或以下。
• CURABLE COMPOSITION FOR INKJET, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
  申请人：Sekisui Chemical Co., Ltd.

  公开号：EP3214142A1

  公开（公告）日：2017-09-06

  Provided is a curable composition for inkjet which can have a prolonged pot life even under an environment in an inkjet device that is warmed to 50°C or higher and which can be cured into a cured product having improved heat resistance and insulation reliability, in spite of the fact that a thermally curable compound is used in the curable composition. The curable composition for inkjet according to the present invention contains a photocurable compound, a thermally curable compound, a photopolymerization initiator and a thermal curing agent and does not contain a solvent or contains the solvent, wherein the content of the solvent in 100% by weight of the curable composition is 1% by weight or less when the curable composition for inkjet contains the solvent, the photocurable compound contains a polyfunctional compound having at least two (meth)acryloyl groups, and the thermal curing agent is an aromatic amine having at least one benzene ring and at least two amino groups.

  本发明提供了一种喷墨用固化组合物，该组合物即使在喷墨设备升温至 50°C 或更高温度的环境下也能延长罐装寿命，并且尽管在固化组合物中使用了热固化化合物，但仍能固化成具有更好的耐热性和绝缘可靠性的固化产品。根据本发明的喷墨用固化组合物含有光固化化合物、热固化化合物、光聚合引发剂和热固化剂，不含溶剂或含有溶剂、其中，当喷墨用可固化组合物含有溶剂时，溶剂在可固化组合物 100% 重量中的含量为 1%（重量比）或更少；光固化化合物含有具有至少两个（甲基）丙烯酰基的多官能团化合物；热固化剂是具有至少一个苯环和至少两个氨基的芳香胺。