ADHESIVE COMPOSITION FOR ELECTRONIC COMPONENTS AND ADHESIVE SHEET FOR ELECTRONIC COMPONENTS USING THE SAME
申请人:Toray Industries, Inc.
公开号:EP2192167A1
公开(公告)日:2010-06-02
In order to provide an adhesive composition for electronic components that is excellent in adhesion durability under long-term high temperature conditions, thermal cyclability, and insulation reliability, designed is an adhesive composition for electronic components containing a thermoplastic resin (a), an epoxy resin (b), a hardener (c), and an organopolysiloxane (d), wherein the glass transition temperature (Tg) after curing is -10°C to 50°C and the rate of change of Tg after heat-treating the composition at 175°C for 1000 hours is 15% or less.
为了提供一种电子元件用粘合剂组合物,该组合物在长期高温条件下具有优异的粘合耐久性、热循环性和绝缘可靠性,设计了一种电子元件用粘合剂组合物,该组合物含有热塑性树脂(a)、环氧树脂(b)、固化剂(c)和有机聚硅氧烷(d),其中固化后的玻璃化转变温度(Tg)为-10°C 至 50°C,在 175°C 下热处理 1000 小时后的 Tg 变化率为 15%或以下。