2,2-二(3-氨基-4-羟基苯基)金刚烷 | 753023-32-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 2,2-二(3-氨基-4-羟基苯基)金刚烷
• 英文名称: 2,2-bis(3-amino-4-hydroxyphenyl)adamantane
• 英文别名: 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-2-adamantyl]phenol
• CAS: 753023-32-4
• 化学式: C₂₂H₂₆N₂O₂
• 分子量: 350.461
• InChiKey: KFYFUBUELUHIJF-UHFFFAOYSA-N

物化性质

• 沸点：
  570.0±50.0 °C(Predicted)
• 密度：
  1.309

计算性质

• 辛醇/水分配系数(LogP)：
  4.6
• 重原子数：
  26
• 可旋转键数：
  2
• 环数：
  6.0
• sp3杂化的碳原子比例：
  0.45
• 拓扑面积：
  92.5
• 氢给体数：
  4
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  2,2-bis(4-hydroxy-3-nitrophenyl)adamantane 在 palladium 10% on activated carbon 氢气 作用下， 以 乙醇 为溶剂， 反应 30.0h， 以100%的产率得到2,2-二(3-氨基-4-羟基苯基)金刚烷
  参考文献：
  名称：

  EP1602641

  摘要：

  公开号：

文献信息

• RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME
  申请人：Fujita Kazuyoshi

  公开号：US20090118431A1

  公开（公告）日：2009-05-07

  A main object of the present invention is to provide a resin composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semiconductor device using the same. In the present invention, the object is achieved by a resin composition comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R 0 is a single bond or has a structure represented by formula (2); R 1 to R 8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R 9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R 1 to R 8 is the group having an alicyclic structure when R 0 is a single bond; at least one of R 1 to R 9 is the group having an alicyclic structure when R 0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.

  本发明的主要目的是提供一种具有高耐热性和低介电常数的树脂组合物，其清漆，树脂膜以及使用该组合物的半导体器件。在本发明中，通过包括具有以下结构的化合物和交联剂的树脂组合物来实现该目标：其中在公式（1）中，R0是单键或具有以下结构的化合物（2）；R1到R8分别为氢、具有脂环结构的基团、具有1到10个碳原子的有机基团（不包括具有脂环结构的基团）、羟基和羧基中的任意一种；“X”是以下任意一种：—O—、—NHCO—、—CONH—、—COO—和—OCO—；此外，在公式（2）中，“Ar”是芳香族基团；“Y”是以下任意一种：单键—O—、—S—、—OCO—和—COO—；“q”是1或更多的整数；当“q”是2或更多的整数时，R9是氢或具有1个或更多碳原子的有机基团，并且可以相同或不同；当R0是单键时，R1到R8中至少有一个是具有脂环结构的基团；当R0具有以下结构的化合物（2）时，R1到R9中至少有一个是具有脂环结构的基团；“*”和“**”表示要与不同化学结构结合的位置。
• BIS(3-AMINO-4-HYDROXYPHENYL)ADAMANTANE DERIVATIVES AND PROCESS FOR PRODUCTION THEREOF
  申请人：IDEMITSU KOSAN COMPANY LIMITED

  公开号：EP1602641A1

  公开（公告）日：2005-12-07

  The invention provides compounds which are excellent in terms of heat resistance, mechanical characteristics, electric characteristics, physical properties, etc. and which provide a novel material useful for, for example, interlayer insulating film or protective film for use in semiconductor devices, interlayer insulating film for use in multilayer wiring boards, cover coating in flexible printed circuits, or a liquid crystal alignment layer. The compounds are bis(3-amino-4-hydroxyphenyl)adamantane derivatives having a structure represented by formula (I) or (II): (each of R1 to R4 represents a halogen atom, a hydroxyl group, an alkyl group, an alkoxyl group, a carboxyl group, or an alkoxycarbonyl group, each of m and a is an integer of 0 to 3, and each of n and b is an integer of 0 to 14, with the proviso that the case where the following three conditions in formula (I) are met is excluded: R2 is methyl and present at a bridgehead; m is 0; and n is 2).

  本发明提供的化合物在耐热性、机械特性、电气特性、物理性能等方面具有优异的性能，并提供了一种新型材料，可用于例如半导体器件中使用的层间绝缘膜或保护膜、多层线路板中使用的层间绝缘膜、柔性印刷电路中的覆盖涂层或液晶配向层。 这些化合物是双(3-氨基-4-羟基苯基)金刚烷衍生物，其结构由式(I)或(II)表示： (R1至R4各自代表卤素原子、羟基、烷基、烷氧基、羧基或烷氧基羰基，m和a各自为0至3的整数，n和b各自为0至14的整数，但不包括满足式（I）中以下三个条件的情况：R2为甲基且存在于桥头；m为0；n为2）。
• Bis(3-amino-4-hydroxyphenyl)adamantane derivatives and process for production thereof
  申请人：Tanaka Shinji

  公开号：US20060161016A1

  公开（公告）日：2006-07-20

  The invention provides compounds which are excellent in terms of heat resistance, mechanical characteristics, electric characteristics, physical properties, etc. and which provide a novel material useful for, for example, interlayer insulating film or protective film for use in semiconductor devices, interlayer insulating film for use in multilayer wiring boards, cover coating in flexible printed circuits, or a liquid crystal alignment layer. The compounds are bis(3-amino-4-hydroxyphenyl)adamantane derivatives having a structure represented by formula (I) or (II): (each of R 1 to R 4 represents a halogen atom, a hydroxyl group, an alkyl group, an alkoxyl group, a carboxyl group, or an alkoxycarbonyl group, each of m and a is an integer of 0 to 3, and each of n and b is an integer of 0 to 14, with the proviso that the case where the following three conditions in formula (I) are met is excluded: R 2 is methyl and present at a bridgehead; m is 0; and n is 2).

  本发明提供的化合物在耐热性、机械特性、电气特性、物理性能等方面具有优异的性能，并提供了一种新型材料，可用于例如半导体器件中使用的层间绝缘膜或保护膜、多层线路板中使用的层间绝缘膜、柔性印刷电路中的覆盖涂层或液晶配向层。 这些化合物是双(3-氨基-4-羟基苯基)金刚烷衍生物，其结构由式(I)或(II)表示： (每个 R 1 至 R 4 代表卤素原子、羟基、烷基、烷氧基、羧基或烷氧基羰基，m 和 a 各为 0 至 3 的整数，n 和 b 各为 0 至 14 的整数，但不包括满足式 (I) 中以下三个条件的情况：R 2 为甲基且存在于桥头；m 为 0；n 为 2）。
• RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM
  申请人：Sumitomo Bakelite Company, Ltd.

  公开号：EP2000510B1

  公开（公告）日：2012-05-02
• US7423180B2
  申请人：——

  公开号：US7423180B2

  公开（公告）日：2008-09-09