2,2-二甲基-N-(3-羟基苯基)丁酰胺 | 55791-91-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 2,2-二甲基-N-(3-羟基苯基)丁酰胺
• 英文名称: 3'-Hydroxy-2,2-dimethylbutyranilid
• 英文别名: 3'-Hydroxy-2,2-dimethylbutyranilide；N-(3-hydroxyphenyl)-2,2-dimethylbutanamide
• CAS: 55791-91-8
• 化学式: C₁₂H₁₇NO₂
• 分子量: 207.272
• InChiKey: OHTSKCNOAVNPTG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.5
• 重原子数：
  15
• 可旋转键数：
  3
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.42
• 拓扑面积：
  49.3
• 氢给体数：
  2
• 氢受体数：
  2

安全信息

• 海关编码：
  2924299090

文献信息

• NEGATIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
  申请人：Shirakawa Koji

  公开号：US20080241745A1

  公开（公告）日：2008-10-02

  A negative resist composition, includes: (A) an alkali-soluble polymer containing a specific repeating unit as defined in the specification; (B) a crosslinking agent capable of crosslinking with the alkali soluble polymer (A) under an action of an acid; (C) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (D) a specific quaternary ammonium salt as defined in the specification; and (E) an organic carboxylic acid, and a pattern forming method uses the composition.
• RESIST COMPOSITION FOR SEMICONDUCTOR, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME
  申请人：TSUCHIMURA Tomotaka

  公开号：US20110318691A1

  公开（公告）日：2011-12-29

  An embodiment of the composition contains any of compounds of general formula (I) below:
• POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS
  申请人：Hatakeyama Jun

  公开号：US20130084528A1

  公开（公告）日：2013-04-04

  A positive resist composition comprising a polymer having carboxyl groups substituted with an acid labile group having formula (1) exhibits a high contrast of alkaline dissolution rate before and after exposure, a high resolution, a reduced acid diffusion rate, and forms a pattern with good profile, minimal edge roughness, and etch resistance. In formula (1), R 1 is methylene or ethylene, R 2 is alkyl, aryl, or alkenyl, which may contain oxygen or sulfur, R 3 is fluorine or trifluoromethyl, and m is an integer of 1 to 4.
• US7432034B2
  申请人：——

  公开号：US7432034B2

  公开（公告）日：2008-10-07
• US8574817B2
  申请人：——

  公开号：US8574817B2

  公开（公告）日：2013-11-05