2,4-二羟基苯-1,3-二羧酸 | 22928-28-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 2,4-二羟基苯-1,3-二羧酸
• 英文名称: 2,4-dihydroxyisophthalic acid
• 英文别名: 2,4-dihydroxy-isophthalic acid；2,4-Dihydroxy-isophthalsaeure；2.4-Dioxy-benzol-dicarbonsaeure-(1.3)；2,4-Dihydroxyisophthalsaeure；Resorcin-2,4-dicarbonsaeure；Dihydroxyisophthalsaure；2,4-dihydroxybenzene-1,3-dicarboxylic acid
• CAS: 22928-28-5
• 化学式: C₈H₆O₆
• 分子量: 198.132
• InChiKey: YWJNJZBDYHRABW-UHFFFAOYSA-N

物化性质

• 熔点：
  179-181 °C
• 沸点：
  448.3±45.0 °C(Predicted)
• 密度：
  1.779±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.5
• 重原子数：
  14
• 可旋转键数：
  2
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  115
• 氢给体数：
  4
• 氢受体数：
  6

安全信息

• 海关编码：
  2918290000

反应信息

• 作为反应物：
  描述：

  甲醇 、 2,4-二羟基苯-1,3-二羧酸 生成 Dimethyl 2,4-dihydroxybenzene-1,3-dicarboxylate
  参考文献：
  名称：

  Madeja-Kotkowska,Z., Bulletin de l'Academie Polonaise des Sciences, Serie des Sciences Chimiques, 1974, vol. 22, p. 365 - 375

  摘要：

  DOI：
• 作为产物：
  描述：

  2,4-dimethoxy-isophthalic acid 在 三氯化铝 、 Petroleum ether 作用下， 生成 2,4-二羟基苯-1,3-二羧酸
  参考文献：
  名称：

  Radha; Shah, Journal of the Indian Chemical Society, 1942, vol. 19, p. 495

  摘要：

  DOI：

文献信息

• METAL-ORGANIC FRAMEWORKS FOR AROMATIC HYDROCARBON SEPARATIONS
  申请人：The Regents of the University of California

  公开号：US20160159713A1

  公开（公告）日：2016-06-09

  The disclosure provides for metal organic frameworks (MOFs) that are selective adsorbents for aromatic hydrocarbons, devices comprising the MOFs thereof, and methods using the MOFS thereof for separating and/or storing aromatic hydrocarbons.

  该披露提供了一种金属有机框架（MOFs），这些框架是对芳香烃选择性吸附剂，包括这些MOFs的设备，以及使用这些MOFs进行芳香烃分离和/或储存的方法。
• INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
  申请人：Ono Kazuo

  公开号：US20100179250A1

  公开（公告）日：2010-07-15

  It is to improve the storage stability of a sealant, to retain the flowability of the sealant when sealing, and to achieve an effective curing rate of the sealant by heating to be applicable as a sealant for delicate semiconductors. It is an epoxy resin composition for sealing a semiconductor, comprising the following component (A) and component (B). (A) an epoxy resin, (B) a clathrate complex comprising (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II) (wherein R 2 represents a hydrogen atom, etc.; R 3 to R 5 represent a hydrogen atom, etc.).

  这是为了改善密封剂的储存稳定性，保持密封时密封剂的流动性，并通过加热实现密封剂的有效固化速率，以适用于精细半导体的密封剂。它是一种用于密封半导体的环氧树脂组合物，包括以下组分（A）和组分（B）。（A）环氧树脂，（B）包括（b1）芳香羧酸化合物和（b2）至少一种由式（II）表示的咪唑化合物的笼形复合物（其中R2表示氢原子等；R3至R5表示氢原子等）。
• Method of preventing polymer-scale formation
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP0320227A2

  公开（公告）日：1989-06-14

  A method of preventing polymer scales from sticking in a polymerization vessel during the polymerization of a monomer having an ethylenically double bond, wherein said polymerization is carried out in a polymerization vessel of which the inner wall and other parts with which said monomer comes into contact during polymerization are previously first coated with (a) a coating solution comprising a cationic dye and the resulting coating is then coated with (b) a coating solution comprising at least one component selected from the group consisting of anionic polymeric compounds, amphoteric polymeric compounds and hydroxyl group-containing organic compounds. Polymer scale formation can be effectively prevented.

  一种在具有乙烯双键的单体聚合过程中防止聚合物鳞片粘附在聚合容器中的方法，其中所述聚合在聚合容器中进行，聚合容器的内壁和在聚合过程中与所述单体接触的其他部分之前先涂有(a)由阳离子染料组成的涂层溶液，然后在所得涂层上涂有(b)由至少一种从阴离子聚合物化合物、两性聚合物化合物和含羟基有机化合物组成的组中选出的组分组成的涂层溶液。可有效防止聚合物结垢。
• ADHESIVE AID COMPOSITION
  申请人：NIPPON KAYAKU KABUSHIKI KAISHA

  公开号：EP1666556A1

  公开（公告）日：2006-06-07

  The present invention provides an adhesive aid composition having excellent adhesive strength to polyimide films without decreasing mechanical properties and being useful in the field of electric materials. An adhesive aid composition of the present invention contains a phenolic hydroxyl group-containing polyamide and a solvent as essential components. The phenolic hydroxyl group-containing polyamide preferably has a segment represented by formula (1): (wherein R1 represents a divalent aromatic group, and n represents an average number of substituents and is a positive number of 1 to 4). The adhesive aid composition of the present invention is suitably used for bonding polyimide films.

  本发明提供了一种助粘剂组合物，该组合物对聚酰亚胺薄膜具有极佳的粘合强度，且不会降低机械性能，可用于电气材料领域。本发明的一种助粘剂组合物含有一种含酚羟基的聚酰胺和一种溶剂作为主要成分。含酚羟基的聚酰胺最好具有由式（1）表示的部分： (其中 R1 代表二价芳香族基团，n 代表取代基的平均数目，为 1 至 4 的正数）。本发明的助粘剂组合物适用于粘合聚酰亚胺薄膜。
• COMPOSITION CONTAINING HYDROXYLATED CONDENSATION RESIN FOR FORMING FILM UNDER RESIST
  申请人：Nissan Chemical Industries, Ltd.

  公开号：EP2042927A1

  公开（公告）日：2009-04-01

  Disclosed is a lithographic composition for forming a resist underlayer film, which can be used as a lower layer antireflection film by which an exposure light striking on a photoresist formed on a semiconductor substrate is inhibited from being reflected from the substrate in a lithographic process of manufacturing semiconductor equipment, a planarization film for flattening a semiconductor substrate having a rugged surface used in order to fill in a hole formed on the semiconductor substrate, a film which prevents a photoresist from being contaminated by a substance generated from a semiconductor substrate during heating/burning, or the like. The lithographic composition for forming a resist underlayer comprises a polymer having a structure of formula (1): (where Y represents a C1-10 alkylene group or a C6-14 aromatic ring, provided that the alkylene group and the aromatic ring have one or more hydroxyl group(s) being not larger than the number of the replaceable hydrogen atom of the alkylene group and the aromatic ring); and a solvent.

  本发明公开了一种用于形成抗蚀剂底层膜的平版印刷组合物，该组合物可在制造半导体设备的平版印刷工艺中用作下层抗反射膜，通过该膜可以抑制照射在形成于半导体衬底上的光刻胶上的曝光光从衬底上反射出去；还可用作用于将表面凹凸不平的半导体衬底压平的平版印刷膜，以填充形成于半导体衬底上的孔洞；还可用作防止光刻胶在加热/燃烧过程中被半导体衬底产生的物质污染的膜等。用于形成抗蚀剂底层的平版印刷组合物包括具有式（1）结构的聚合物： (其中 Y 代表 C1-10 亚烷基或 C6-14 芳环，条件是亚烷基和芳环具有一个或多个羟基，其数目不大于亚烷基和芳环的可取代氢原子数）；以及溶剂。