申请人:Intera Company, Ltd
公开号:EP0294531A2
公开(公告)日:1988-12-14
A process for improving the flame retardancy, hygroscopic, soil release and other properties of a polymer substrate is provided in which the substrate is contacted with a suitable aqueous mixture containing a water-soluble monomer and an organic halogen-containing hydrophobic carrier compound at a temperature of between about 40°C to 100°C. Polymerization of the monomer is thereafter initiated by a chemical or physical initiator to form a polymer evenly disposed on the substrate. The flame retardancy, hygroscopic, soil release and other surface properties of the substrate are thereby improved. The mixture may be in the form of an emulsion wherein the hydrophobic carrier compound is emulsified by an appropriate agent. The invention also pertains to the improved substrates prepared in accordance with the present process.
本发明提供了一种用于改善聚合物基材的阻燃性、吸湿性、土壤释放性和其他特性的工艺,在该工艺中,基材在约 40°C 至 100°C 的温度下与含有水溶性单体和有机含卤疏水载体化合物的适当水性混合物接触。之后,单体通过化学或物理引发剂开始聚合,形成均匀分布在基底上的聚合物。基材的阻燃性、吸湿性、土壤释放性和其他表面特性因此得到改善。混合物可以是乳液形式,其中疏水性载体化合物由适当的药剂乳化。本发明还涉及根据本工艺制备的改良基材。