phenyl-phosphonic acid divinyl ester | 57453-74-4

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 有机膦酸及其衍生物
• 英文名称: phenyl-phosphonic acid divinyl ester
• 英文别名: Phenyl-phosphonsaeure-divinylester；Bis(ethenoxy)phosphorylbenzene
• CAS: 57453-74-4
• 化学式: C₁₀H₁₁O₃P
• 分子量: 210.169
• InChiKey: BUAIYNOXVIVNLG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.5
• 重原子数：
  14
• 可旋转键数：
  5
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  35.5
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  苯膦酰二氯 在 三氯化铝 、 sodium carbonate 作用下， 生成 phenyl-phosphonic acid divinyl ester
  参考文献：
  名称：

  Diethyl Vinyl Phosphate, Divinyl Benzenephosphonate and their Polymers

  摘要：

  DOI：

  10.1021/ja01103a536

文献信息

• PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP2141198A1

  公开（公告）日：2010-01-06

  Provided is a process for producing a thermosetting resin varnish from which a printed circuit board can be produced wherein the printed circuit board has excellent dielectric properties in a high frequency band and can significantly reduce the transmission loss, and exhibits excellent heat resistance after moisture absorption and excellent thermal expansion properties and satisfies the metallic foil peeling strength. A process for producing a thermosetting resin varnish containing a thermosetting resin composition, which contains an uncured semi-IPN composite, an inorganic filler, and a saturated thermoplastic elastomer, wherein the process comprises the steps of: (i) preliminary reacting (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified and (C) a crosslinking agent, in the presence of (A) a polyphenylene ether to obtain a polyphenylene ether-modified butadiene prepolymer which is an uncured semi-IPN composite; (ii) mixing together (D) an inorganic filler and (E) a saturated thermoplastic elastomer to obtain a mixture; and (iii) mixing together the obtained mixture and the polyphenylene ether-modified butadiene prepolymer, a resin varnish, a prepreg, and a metal-clad laminate provided using the same.

  本发明提供了一种生产热固性树脂清漆的工艺，用该清漆可生产出印刷电路板，其中的印刷电路板在高频段具有优异的介电性能，可显著降低传输损耗，吸湿后具有优异的耐热性和优异的热膨胀性能，并满足金属箔的剥离强度。 一种含有热固性树脂组合物的热固性树脂清漆的生产工艺，该热固性树脂组合物含有未固化的半 IPN 复合材料、无机填料和饱和热塑性弹性体，其中该工艺包括以下步骤：(i) 在(A)聚苯醚存在下，初步反应(B)丁二烯聚合物，该聚合物在其分子中含有 40% 或更多的 1，2-丁二烯单元，其侧链中含有 1，2-乙烯基，且未进行化学改性，以及(C)交联剂，以获得聚苯醚改性的丁二烯预聚物，该预聚物是一种未固化的半 IPN 复合材料；(ii) 将(D)无机填料和(E)饱和热塑性弹性体混合在一起，得到一种混合物；以及 (iii) 将得到的混合物和聚苯醚改性丁二烯预聚物、树脂清漆、预浸料以及使用该混合物提供的金属包覆层压板混合在一起。
• Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP2407503A1

  公开（公告）日：2012-01-18

  Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition comprising a polyphenylene ether-modified butadiene prepolymer comprising a polyphenylene ether (A) and a butadiene polymer (B'), characterized in that the component (A) has a number average molecular weight in the range of 7000 to 30000; the component (B') comprises 40% or more of a unit derived from a 1,2-butadiene unit having a 1,2-vinyl group in a side chain; the component (B') is not a modified polybutadiene in which the 1,2-vinyl group in the side chain, or one or both of the terminals in the molecule of the component (B') is/are chemically modified by converting into epoxy, glycol, phenol, maleic acid, (meth)acryl, or urethane; and the component (B') has a cross-linked structure; and a resin varnish, a prepreg and a metal clad laminated board using the same.

  本发明提供了一种可用于生产印刷电路板的热固性树脂组合物，该组合物在高频段具有良好的介电性能，从而可显著降低传输损耗，在吸湿后具有优异的耐热性和热膨胀性能，并可满足树脂组合物与金属箔之间的剥离强度。 本发明涉及一种热固性树脂组合物，该组合物包含一种聚苯醚改性丁二烯预聚物，该预聚物由聚苯醚（A）和丁二烯聚合物（B'）组成，其特征在于：组分（A）的平均分子量在 7000 至 30000 之间；组分（B'）包含 40% 或更多的由 1，2-丁二烯单元衍生而来的单元，该单元的侧链中含有 1，2-乙烯基；组分（B'）不是改性聚丁二烯，其中侧链中的 1,2-乙烯基或组分（B'）分子中的一个或两个末端通过转化为环氧、乙二醇、苯酚、马来酸、（甲基）丙烯酸或聚氨酯而被化学改性；以及组分（B'）具有交联结构。
• Thermosetting resin composition of semi-ipn composite, and varnish, prepreg and metal clad laminated board using the same
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP2546287A1

  公开（公告）日：2013-01-16

  Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition comprising a polyphenylene ether-modified butadiene prepolymer comprising a polyphenylene ether (A) and a butadiene polymer (B'), characterized in that the component (A) has a number average molecular weight in the range of 7000 to 30000; the component (B') comprises 40% or more of a unit derived from a 1,2-butadiene unit having a 1,2-vinyl group in a side chain; the component (B') is not a modified polybutadiene in which the 1,2-vinyl group in the side chain, or one or both of the terminals in the molecule of the component (B') is/are chemically modified by converting into epoxy, glycol, phenol, maleic acid, (meth)acryl, or urethane; and the component (B') has a cross-linked structure; and a resin varnish, a prepreg and a metal clad laminated board using the same.

  本发明提供了一种可用于生产印刷电路板的热固性树脂组合物，该组合物在高频段具有良好的介电性能，从而可显著降低传输损耗，在吸湿后具有优异的耐热性和热膨胀性能，并可满足树脂组合物与金属箔之间的剥离强度。 本发明涉及一种热固性树脂组合物，该组合物包含一种聚苯醚改性丁二烯预聚物，该预聚物由聚苯醚（A）和丁二烯聚合物（B'）组成，其特征在于：组分（A）的平均分子量在 7000 至 30000 之间；组分（B'）包含 40% 或更多的由 1，2-丁二烯单元衍生而来的单元，该单元的侧链中含有 1，2-乙烯基；组分（B'）不是改性聚丁二烯，其中侧链中的 1,2-乙烯基或组分（B'）分子中的一个或两个末端通过转化为环氧、乙二醇、苯酚、马来酸、（甲基）丙烯酸或聚氨酯而被化学改性；以及组分（B'）具有交联结构。
• METHOD FOR PRODUCING MASTERBATCHES
  申请人：Adeka Corporation

  公开号：EP2796487A1

  公开（公告）日：2014-10-29

  The present invention provides a method of producing a masterbatch which can yield a masterbatch that contains a metal salt compound and has an improved moldability with little coloration. The method of producing a masterbatch according to the present invention is a method of producing a masterbatch in which a metal salt compound is incorporated into a polyester resin, the method being characterized by comprising: a first step of obtaining a kneaded product by feeding the polyester resin and the metal salt compound to an extruder and melt-kneading the polyester resin and the metal salt compound; and a second step of, while continuing kneading after the first step, further feeding the polyester resin to the extruder and kneading the resulting mixture, wherein, in the first step, the polyester resin and the metal salt compound are fed at such a mass ratio that the amount of the metal salt compound is not more than twice the amount of the polyester resin; the total amount of the polyester resin fed in the first and second steps and the metal salt compound fed in the first step is, in terms of mass ratio, in the range of 2 to 20 times the total amount of the polyester resin and the metal salt compound that are fed in the first step.

  本发明提供了一种母料的生产方法，该方法可生产出含有金属盐化合物的母料，且母料的成型性得到改善，着色少。 根据本发明的母料生产方法是一种在聚酯树脂中掺入金属盐化合物的母料生产方法，其特征在于该方法包括：第一步，通过将聚酯树脂和金属盐化合物加入挤出机，并对聚酯树脂和金属盐化合物进行熔融捏合，得到捏合产品；第二步，在第一步后继续捏合的同时，进一步将聚酯树脂加入挤出机，并对得到的混合物进行捏合，其中，在第一步中，聚酯树脂和金属盐化合物的加入量比例为金属盐化合物的量不超过聚酯树脂量的两倍；在第一步和第二步中加入的聚酯树脂和在第一步中加入的金属盐化合物的总量，就质量比而言，是在第一步中加入的聚酯树脂和金属盐化合物总量的 2 至 20 倍之间。
• METHOD FOR PRODUCING OLEFIN RESIN COMPOSITION FOR ELECTRIC APPLIANCE MATERIALS AND AUTOMOTIVE INTERIOR MATERIALS
  申请人：Adeka Corporation

  公开号：EP2829554A1

  公开（公告）日：2015-01-28

  The present invention provides a method capable of producing an olefin resin composition for a home electric appliance materials and automotive interior materials that has good color tone and shows excellent fogging resistance, in which method the total amount of stabilizer(s) to be added is reduced and cost reduction can thus be attained. The method of producing an olefin resin composition for an automotive interior material by polymerization of an olefin monomer according to the present invention is characterized by comprising the step of adding, before or during the polymerization of an olefin monomer, 0.001 to 0.5 parts by mass of a phenolic antioxidant, which is represented by the following Formula (1) and masked with an organoaluminum compound, with respect to 100 parts by mass of an olefin resin obtained by the polymerization: (wherein, R represents an alkyl group having 1 to 30 carbon atoms which is optionally branched, a cycloalkyl group having 3 to 12 carbon atoms which is optionally substituted or an aryl group having 6 to 18 carbon atoms which is optionally substituted).

  本发明提供了一种能够生产用于家电材料和汽车内饰材料的烯烃树脂组合物的方法，该组合物具有良好的色调和优异的抗雾性，在该方法中，需要添加的稳定剂总量减少，从而可以降低成本。根据本发明，通过烯烃单体聚合生产汽车内饰材料用烯烃树脂组合物的方法，其特征在于包括以下步骤：在烯烃单体聚合之前或聚合过程中，相对于聚合得到的 100 份烯烃树脂，加入 0.001 至 0.5 份（质量）的酚类抗氧化剂，该抗氧化剂由下式（1）表示，并用有机铝化合物掩蔽： (其中，R 代表具有 1 至 30 个碳原子且任选支化的烷基、具有 3 至 12 个碳原子且任选被取代的环烷基或具有 6 至 18 个碳原子且任选被取代的芳基）。