2-ethyl-4,6-bis-hydroxymethyl-phenol | 68658-13-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2-ethyl-4,6-bis-hydroxymethyl-phenol
• 英文别名: 4-Hydroxy-1.3-bis-hydroxymethyl-5-aethyl-benzol；2-Aethyl-4,6-bis-hydroxymethyl-phenol；2-Ethyl-4,6-bis(hydroxymethyl)phenol
• CAS: 68658-13-9
• 化学式: C₁₀H₁₄O₃
• 分子量: 182.219
• InChiKey: NTLUIMJJXIINIM-UHFFFAOYSA-N

物化性质

• 沸点：
  371.4±37.0 °C(Predicted)
• 密度：
  1.228±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.1
• 重原子数：
  13
• 可旋转键数：
  3
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.4
• 拓扑面积：
  60.7
• 氢给体数：
  3
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  乙基苯酚 、 聚合甲醛 在 sodium hydroxide 作用下， 生成 2-ethyl-4,6-bis-hydroxymethyl-phenol
  参考文献：
  名称：

  Hydroxymethyl Derivatives of Phenols

  摘要：

  DOI：

  10.1021/ja01184a514

文献信息

• Novolac resin-containing resist underlayer film-forming composition using bisphenol aldehyde
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US10017664B2

  公开（公告）日：2018-07-10

  Resist underlayer film-forming composition for forming resist underlayer film with high dry etching resistance, wiggling resistance and exerts good flattening property and embedding property for uneven parts, including resin obtained by reacting organic compound A including aromatic ring and aldehyde B having at least two aromatic hydrocarbon ring groups having phenolic hydroxy group and having structure wherein the aromatic hydrocarbon ring groups are bonded through tertiary carbon atom. The aldehyde B may be compound of Formula (1): The obtained resin may have a unit structure of Formula (2): Ar1 and Ar2 each are C6-40 aryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent. Forming resist pattern used for semiconductor production, including forming resist underlayer film by applying the resist underlayer film-forming composition onto semiconductor substrate and baking it.

  用于形成具有高干法蚀刻抗性、抗扭曲性并具有良好的平整性和嵌入性能的抗蚀底层膜形成组合物，包括通过使含有芳香环的有机化合物A和至少具有两个含酚羟基的芳香烃环团的醛B反应而获得的树脂，并具有芳香烃环团通过三级碳原子键合的结构。醛B可以是化合物的化学式（1）： 所得的树脂可能具有化学式（2）的单元结构： Ar1和Ar2各自是C6-40芳基团。含有芳香环的有机化合物A可能是芳香胺或含酚羟基的化合物。该组合物可能进一步含有溶剂、酸和/或酸发生剂，或交联剂。用于半导体生产的形成抗蚀图案，包括通过将抗蚀底层膜形成组合物涂覆在半导体衬底上并对其进行烘烤来形成抗蚀底层膜。
• SILOXANE-BASED RESIN COMPOSITION
  申请人：Suwa Mitsuhito

  公开号：US20100316953A1

  公开（公告）日：2010-12-16

  The present invention is a siloxane-based resin composition including a siloxane-based resin and an imidosilane compound having a specific structure. Moreover, the present invention is a siloxane-based resin composition including a siloxane-based resin which is a reactive product to be obtained by hydrolyzing an alkoxysilane compound and an imidosilane compound having a specific structure and then making the resulting hydrolysate undergo a condensation reaction. According to the present invention, it is possible to form a cured film excellent in adhesion.

  本发明是一种基于硅氧烷的树脂组合物，包括一种基于硅氧烷的树脂和一种具有特定结构的亚氨基硅烷化合物。此外，本发明还是一种基于硅氧烷的树脂组合物，包括一种基于硅氧烷的树脂，该树脂是通过水解烷氧基硅烷化合物和具有特定结构的亚氨基硅烷化合物反应产生的反应产物，然后使所得到的水解产物经历缩合反应而得到的。根据本发明，可以形成具有优异附着力的固化膜。
• NOVOLAC RESIN-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION USING BISPHENOL ALDEHYDE
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US20160068709A1

  公开（公告）日：2016-03-10

  Resist underlayer film-forming composition for forming resist underlayer film with high dry etching resistance, wiggling resistance and exerts good flattening property and embedding property for uneven parts, including resin obtained by reacting organic compound A including aromatic ring and aldehyde B having at least two aromatic hydrocarbon ring groups having phenolic hydroxy group and having structure wherein the aromatic hydrocarbon ring groups are bonded through tertiary carbon atom. The aldehyde B may be compound of Formula (1): The obtained resin may have a unit structure of Formula (2): Ar 1 and Ar 2 each are C 6-40 aryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent. Forming resist pattern used for semiconductor production, including forming resist underlayer film by applying the resist underlayer film-forming composition onto semiconductor substrate and baking it.

  高干法蚀刻抗性、抗扭曲性、并对不平整部分表现出良好的平整和嵌入性的抗阻层薄膜形成组合物，包括通过反应含芳香环的有机化合物A和至少有两个芳香族碳环环团且具有酚羟基的醛B所获得的树脂，并具有芳香族碳环环团通过三级碳原子键合的结构。醛B可以是化合物式（1）的化合物：所获得的树脂可以具有式（2）的单元结构：其中Ar1和Ar2各自是C6-40芳基团。含芳香环的有机化合物A可以是芳香胺或含酚羟基的化合物。该组合物还可以含有溶剂、酸和/或酸发生剂，或交联剂。用于半导体生产的形成光刻图形，包括将抗阻层薄膜形成组合物涂覆在半导体基板上并烘烤以形成抗阻层薄膜。
• Polynuclear polyhydric phenols and process for preparation thereof
  申请人：MITSUI PETROCHEMICAL INDUSTRIES, LTD.

  公开号：EP0117759A1

  公开（公告）日：1984-09-05

  A polynuclear polyhydric phenol of the general formula (I); wherein R1 and R2 each represent a hydrogen atom or a C1-C4 alkyl group, R3 represents a hydrogen atom, an alkyl group, an aryl group or a halogen atom, and n is an integer of from 0 to 10, can be used to provide a polyepoxy compound which is a polyglycidyl ether of the polynuclear polyhydric ether. When the polyepoxy compound is combined with a curing agent, a curable epoxy resin composition results which can be used to provide molded cured articles having excellent heat resistance characteristics.

  通式(I)的多核多氢酚； 其中 R1 和 R2 分别代表氢原子或 C1-C4 烷基，R3 代表氢原子、烷基、芳基或卤素原子，n 为 0 至 10 的整数。当该聚环氧化合物与固化剂结合时，可产生一种可固化的环氧树脂组合物，该组合物可用于提供具有优异耐热性能的模塑固化制品。
• PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
  申请人：Toray Industries, Inc.

  公开号：EP3203320A1

  公开（公告）日：2017-08-09

  To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A), wherein the polysiloxane (A) is a polysiloxane represented by the general formula (1), and wherein (X) and (Y) are represented by the general formulas (4) to (6). 7.5≤X≤75 2.5≤Y≤40 1.5×Y≤X≤3×Y

  提供一种光敏树脂组合物，该组合物能够形成具有高分辨率的图案并获得具有优异的耐热性和抗裂性的固化膜，而且还可进行碱显影；提供一种方法，该方法能够缩短在半导体衬底上形成杂质区后去除该组合物固化膜所需的步骤；以及提供一种使用该组合物制造半导体器件的方法。公开了一种包括聚硅氧烷(A)的光敏树脂组合物，其中聚硅氧烷(A)是由通式(1)表示的聚硅氧烷，且(X)和(Y)由通式(4)至(6)表示。7.5≤x≤75 2.5≤y≤40 1.5×y≤x≤3×y