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2-(2-chlorobenzyl)-1H-benzo[d]imidazole | 213133-88-1

中文名称
——
中文别名
——
英文名称
2-(2-chlorobenzyl)-1H-benzo[d]imidazole
英文别名
2-(2-Chlorobenzyl)-1H-benzimidazole;2-[(2-chlorophenyl)methyl]-1H-benzimidazole
2-(2-chlorobenzyl)-1H-benzo[d]imidazole化学式
CAS
213133-88-1
化学式
C14H11ClN2
mdl
MFCD09880336
分子量
242.708
InChiKey
XYDPQCXIGVLALP-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 熔点:
    215-217 °C
  • 沸点:
    479.7±28.0 °C(Predicted)
  • 密度:
    1.301±0.06 g/cm3(Predicted)

计算性质

  • 辛醇/水分配系数(LogP):
    3.9
  • 重原子数:
    17
  • 可旋转键数:
    2
  • 环数:
    3.0
  • sp3杂化的碳原子比例:
    0.071
  • 拓扑面积:
    28.7
  • 氢给体数:
    1
  • 氢受体数:
    1

安全信息

  • 危险等级:
    IRRITANT

反应信息

  • 作为产物:
    描述:
    2-氯苯乙炔邻苯二胺copper(l) iodide对甲苯磺酰叠氮三乙胺硫酸 作用下, 以 乙腈 为溶剂, 反应 10.0h, 以71%的产率得到2-(2-chlorobenzyl)-1H-benzo[d]imidazole
    参考文献:
    名称:
    通过邻氨基苯胺或萘-1,8-二胺与炔烃和对甲苯磺酰叠氮化物的级联反应一锅法合成功能化苯并咪唑和1H-嘧啶
    摘要:
    据报道,通过邻氨基苯胺或萘-1,8-二胺与末端炔烃和对甲苯磺酰基叠氮化物的级联反应,一锅合成功能化苯并咪唑和 1H-嘧啶。该协议高效且通用。
    DOI:
    10.1055/s-0029-1217515
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文献信息

  • One-Pot Synthesis of Functionalized Benzimidazoles and 1H-Pyrimidines via Cascade Reactions of o-Aminoanilines or Naphthalene-1,8-diamine with Alkynes and p-Tolylsulfonyl Azide
    作者:Yanguang Wang、Jin She、Zheng Jiang
    DOI:10.1055/s-0029-1217515
    日期:2009.7
    A one-pot synthesis of functionalized benzimidazoles and 1H-pyrimidines via the cascade reactions of o-aminoanilines or naphthalene-1,8-diamine with terminal alkynes and p-tolylsulfonyl azide is reported. The protocol is efficient and general.
    据报道,通过邻氨基苯胺或萘-1,8-二胺与末端炔烃和对甲苯磺酰基叠氮化物的级联反应,一锅合成功能化苯并咪唑和 1H-嘧啶。该协议高效且通用。
  • Exploration of 2-benzylbenzimidazole scaffold as novel inhibitor of NF-κB
    作者:PullaReddy Boggu、Eeda Venkateswararao、Manoj Manickam、Dajin Kwak、Youngsoo Kim、Sang-Hun Jung
    DOI:10.1016/j.bmc.2016.03.012
    日期:2016.4
    previously reported. Although most of the benzimidazole derivatives showed strong inhibitory activity in low micromolar potency, 2-(4-methoxybenzyl)-1H-benzo[d]imidazole (3m; IC50 = 1.7 μM) and 2-(2-methoxybenzyl)-1H-benzo[d]imidazole (3n; IC50 = 2.4 μM) showed the best inhibition. The structure activity relationship revealed that 2-benzylbenzimidazole scaffold with hydrogen bonding acceptor on phenyl
    为了找到新的核因子κB活性抑制剂,合理设计,合成和系统研究了一系列苯并咪唑衍生物对RAW 264.7细胞中LPS诱导的NF-κB抑制的体外活性,基于基于柔性查尔酮JSH的SEAP分析(先前报道的((E)-1-(2-羟基-6-(异戊氧基)苯基)-3-(4-羟基苯基)丙-2-烯-1-酮)。尽管大多数苯并咪唑衍生物在低微摩尔浓度下均显示出强大的抑制活性,但是2-(4-甲氧基苄基)-1 H-苯并[ d ]咪唑(3m; IC 50  = 1.7μM)和2-(2-甲氧基苄基)-1 H-苯并[ d ]咪唑(3n ; IC50  = 2.4μM)表现出最好的抑制作用。结构活性关系表明,在苯环上带有氢键受体的2-苄基苯并咪唑支架以药效团的形式出现。
  • Process for treating adhesion promoted metal surfaces with epoxy resins
    申请人:Shipley Co. L.L.C.
    公开号:EP1209253A2
    公开(公告)日:2002-05-29
    A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material, The method involves post-treating the micro-roughened conversion coated metal surface with an epoxy resin composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition, The method can be employed in the circuit board industry to improve bonding between innerlayers in a multiplayer circuit board.
    一种处理微粗化金属表面以提高金属表面与聚合物材料之间粘合力的方法,该方法包括在微粗化转换涂层金属表面用附着力促进组合物形成后,用环氧树脂组合物对微粗化转换涂层金属表面进行后处理,该方法可用于电路板行业,以提高多层电路板内层之间的粘合力。
  • Process for treating adhesion promoted metal surfaces with an organo-silcon post-treatment
    申请人:Shipley Company, L.L.C.
    公开号:US20020132056A1
    公开(公告)日:2002-09-19
    A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous organo-silicon wetting composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. Suitable organo-silicons include organosilanes, organosiloxanes, organosilizanes and the like. The method can be employed in the circuit board industry to improve bonding between layers in multilayer circuit boards.
    一种处理微粗化金属表面以改善金属表面与聚合物材料之间粘合的方法。该方法包括在用附着力促进组合物形成微粗化转化涂层金属表面后,用水性有机硅润湿组合物对微粗化转化涂层金属表面进行后处理。合适的有机硅包括有机硅烷、有机硅氧烷、有机硅氮烷等。该方法可用于电路板行业,以改善多层电路板层间的粘合。
  • Adhesion method
    申请人:Shipley Company, L.L.C.
    公开号:US20040161545A1
    公开(公告)日:2004-08-19
    A primer composed of a polymer solution is applied to a roughened metal surface, and a polymer material such as a pre-preg is applied to the treated metal surface to form a bond between the metal and the polymer material.
    在粗糙的金属表面涂上由聚合物溶液组成的底漆,然后在处理过的金属表面涂上预浸料等聚合物材料,以在金属和聚合物材料之间形成粘合。
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