A highly thermally conductive thermoplastic resin composition of the present invention contains: (A) a thermoplastic polyester resin having a weight average molecular weight of 50,000 to 200,000; (B) a polyalkylene terephthalate block copolymer composed of a polyether segment and a polyethylene terephthalate segment which includes an ethylene terephthalate unit as a main component; and (C) a highly thermally conductive inorganic compound, the highly thermally conductive thermoplastic resin composition containing, with respect to 100 parts by weight of (A) the thermoplastic polyester resin, 20 parts by weight to 200 parts by weight of (B) the polyalkylene terephthalate block copolymer and 20 parts by weight to 250 parts by weight of (C) the highly thermally conductive inorganic compound.
本发明的一种高导热性热塑性
树脂组合物含有(A) 热塑性聚酯
树脂,其重量平均分子量在 50,000 至 200,000 之间;(B) 聚
对苯二甲酸乙二醇酯嵌段共聚物,由聚醚段和聚
对苯二甲酸乙二醇酯段组成,其中包括作为主要成分的
对苯二甲酸乙二醇酯单元;(C) 高导热性无机化合物,该高导热性热塑性
树脂组合物中,相对于 100 重量份的(A)热塑性聚酯
树脂,含有 20 至 200 重量份的(B)聚
对苯二甲酸乙二醇酯嵌段共聚物和 20 至 250 重量份的(C)高导热性无机化合物。