BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE
申请人:Sumitomo Bakelite Company, Limited
公开号:EP1832619A1
公开(公告)日:2007-09-12
A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.
一种苯并恶唑树脂前体,包括由双氨基苯酚化合物和二羧酸化合物反应得到的 第一重复单元,其中至少一个重复单元具有菱形结构;苯并恶唑树脂前体,进一步包含第二重复单元,该第二重复单元由无菱形结构的双氨基苯酚化合物和无菱形结构的二羧酸化合物反应得到; 通过上述苯并恶唑树脂前体的脱水闭环反应得到的聚苯并恶唑树脂; 由苯并恶唑树脂前体或聚苯并恶唑树脂构成的树脂薄膜。利用苯并恶唑树脂前体可获得具有优异耐热性和较小介电常数的聚苯并恶唑树脂和树脂薄膜,以及使用该树脂薄膜的半导体器件。