[EN] COMPOUNDS USEFUL FOR INHIBITING ROR-GAMMA-T<br/>[FR] COMPOSÉS UTILES POUR L'INHIBITION DU ROR-GAMMA-T
申请人:LILLY CO ELI
公开号:WO2018160550A1
公开(公告)日:2018-09-07
The present invention provides novel ROR gamma-t inhibitors and pharmaceutical compositions thereof, formula (A).
本发明提供了新颖的ROR gamma-t抑制剂及其药物组合物,化学式(A)。
COMPOUNDS USEFUL FOR INHIBITING ROR-GAMMA-T
申请人:Eli Lilly and Company
公开号:US20170066781A1
公开(公告)日:2017-03-09
The present invention provides novel ROR gamma-t inhibitors and pharmaceutical compositions thereof:
本发明提供了新型ROR gamma-t抑制剂及其药物组合物:
Conformationally restricted benzothienoazepine respiratory syncytial virus inhibitors: their synthesis, structural analysis and biological activities
作者:Euan A. F. Fordyce、S. Fraser Hunt、Damien Crepin、Stuart T. Onions、Guillaume F. Parra、Chris J. Sleigh、John King-Underwood、Harry Finch、John Murray
DOI:10.1039/c8md00033f
日期:——
viral pathogenicity is strongly associated with the conformation adopted by the modified tricyclic scaffolds. This is particularly evident in the case of the C-5 homologues in which one atropisomer was found to be potently active and the other essentially inert. These results provide compelling evidence that we have determined the bioactive conformation shared by RSV inhibitors that employ the thienobenazapine
The present invention provides novel ROR gamma-t inhibitors and pharmaceutical compositions thereof, formula (A).
本发明提供了新型 ROR γ-t 抑制剂及其药物组合物,式(A)。
Modified Phenolic Resin, Epoxy Resin Composition Containing the Same, and Prepreg Containing the Composition
申请人:Abe Takaharu
公开号:US20080044667A1
公开(公告)日:2008-02-21
The modified phenolic resin of the present invention has a specific structure in which a side chain of an aromatic ring having a hydroxyl group in a phenolic resin that is an alternate copolymer of a phenolic compound and a compound having a divalent connecting group, is substituted with a group represented by general formula (1-1). By using the modified phenolic resin as a hardener for epoxy resins, there are provided an epoxy resin, a composition thereof, and a cured product thereof having excellent adhesion and flame retardancy without impairing properties of conventional phenolic resins such as gel time, glass transition temperature, moisture absorption, and mechanical properties.
(In the formula, R
1
represents a C
1-8
linear, branched, or cyclic hydrocarbon group.)
The present invention provides an epoxy resin composition with excellent adhesion and flame retardancy in uses such as hardeners for semiconductor sealing epoxy resins, insulating materials for electrical/electronic components, and laminates (printed circuit boards). A prepreg containing a glass substrate impregnated with the epoxy resin composition, a laminate, and an electronic circuit board are also provided.