Copolymeric and amphiphilic and polyimide precursor, process for preparing the same and thin film
申请人:KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA
公开号:EP0247358A2
公开(公告)日:1987-12-02
A copolymeric amphiphilic polyimide precursor having the recurring unit of the formula (1):
wherein R1 is a tetravalent group having at least 2 carbon atoms, R2 is a bivalent group having at least 2 carbon atoms, and R3, R4, R5 and R6 are hydrogen atom or a monovalent group having 1 to 30 carbon atoms selected from the group consisting of an aliphatic group, an alicyclic group, an aromatic group, a group in which an aliphatic group is combined with an aromatic group, or an alicyclic group, and their groups substituted by a halogen atom, nitro group, amino group, cyano group, methoxy group or acetoxyl group, provided that at least one of R3, R4, R5 and R6 is neither hydrogen atom nor the above-mentioned group which has 1 to 11.carbon atoms; a part of at least one of said R1 and said R2 being substituted with a group having a valence different therefrom. The precursor of the present invention can provide thin films by the LB technique, and by ring closure of the obtained LB films, there can be obtained ultrathin films having excellent heat resistance, electric properties, chemical resistance and mechanical properties, and having a thickness of not more than 10,000 A, and if desired, a thickness of 10 to 1,000 A. Further, according to the process of the invention, polyimide thin films having a wide range of properties can be easily prepared. When a part of the group R2 is substituted with a trivalent or tetravalent group, the heat resistance can be improved since a ring having better heat resistance than an imide ring is formed.
一种具有式(1)重复单元的共聚两亲性聚酰亚胺前体:
其中 R1 是至少具有 2 个碳原子的四价基团,R2 是至少具有 2 个碳原子的二价基团,R3、R4、R5 和 R6 是氢原子或具有 1 至 30 个碳原子的单价基团,该单价基团选自由脂肪族基团、脂环族基团、芳香族基团组成的组、脂肪族基团与芳香族基团或脂环族基团结合的基团,以及它们的基团被卤素原子、硝基、氨基、氰基、甲氧基或乙酰氧基取代,条件是 R3、R4、R5 和 R6 中至少有一个既不是氢原子,也不是上述具有 1 至 11 个碳原子的基团。碳原子;所述 R1 和所述 R2 中至少有一个的一部分被与之不同价的基团取代。本发明的前体可以通过浐灞技术提供薄膜,通过对所获得的浐灞薄膜进行环封闭,可以获得具有优异的耐热性、电性能、耐化学性和机械性能的超薄薄膜,其厚度不超过 10,000 A,如果需要,厚度可为 10 至 1,000 A。当基团 R2 的一部分被三价或四价基团取代时,由于形成的环比亚胺环具有更好的耐热性,因此可以提高耐热性。