Aluminum Phosphorus Acid Salts as Epoxy Resin Cure Inhibitors
申请人:TIMBERLAKE LARRY D.
公开号:US20120296013A1
公开(公告)日:2012-11-22
Certain aluminum salts of organic phosphorus acids are found to have a strong effect on inhibiting the epoxy cure rate in epoxy formulations. The substances act catalytically and can be used at a low level in an epoxy formulation to adjust the reactivity of a resin formulation to give longer gel times. Compositions and methods of preparing and using the compositions are disclosed.
Resin compositions comprising flame retardant materials obtained by heating phosphonic acid salts at temperatures above 200° C., have excellent properties and exhibit manageable curing behavior. Laminates, composites, molded articles and the like, which have excellent flame retardant properties and physical characteristics, are readily prepared from the resin compositions of the invention.
A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including:
(I) a non-halogenated epoxy resin material selected from:
(A) a non-halogenated phosphorus element-containing epoxy resin;
(B) a mixture of:
(1) a non-halogenated, non-phosphorus element-containing epoxy resin, and
(2) a phosphorus element-containing compound; or
(C) the reaction product of:
(1) a non-halogenated epoxy resin; and
(2) a phosphorus element-containing compound; or
(D) a combination of two or more of components (A) to (C); and
(II) (A) a multi-functional phenolic crosslinking agent having a hydroxy functionality of at least 2; (B) a material which forms a multifunctional phenolic crosslinking agent having a hydroxy functionality of at least 2, upon heating or (C) a mixture of components (A) and (B); in an amount of from about 50% to about 150% of the stoichiometric amount needed to cure the epoxy resin. Electrical laminate circuit boards having reduced flammability may be made from these compositions.
A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including:
(I) a non-halogenated epoxy resin material selected from:
(A) a non-halogenated phosphorus element-containing epoxy resin;
(B) a mixture of:
(1) a non-halogenated, non-phosphorus element-containing epoxy resin, and
(2) a phosphorus element-containing compound; or
(C) the reaction product of:
(1) a non-halogenated epoxy resin; and
(2) a phosphorus element-containing compound; or
(D) a combination of two or more of components (A) to (C); and
(II) (A) a multi-functional phenolic crosslinking agent having a hydroxy functionality of at least 2; (B) a material which forms a multifunctional phenolic crosslinking agent having a hydroxy functionality of at least 2, upon heating or (C) a mixture of components (A) and (B); in an amount of from about 50% to about 150% of the stoichiometric amount needed to cure the epoxy resin. Electrical laminate circuit boards having reduced flammability may be made from these compositions.
The present invention is a halogen-free ignition resistant polymer composition comprising: A) a thermoplastic polymer, and B) a phosphorus element-containing epoxy resin.