3,3'-二乙酰基对二氨基联苯 | 98805-29-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 3,3'-二乙酰基对二氨基联苯
• 英文名称: 3,3'-Diacetylbenzidine
• 英文别名: 1-[5-(3-acetyl-4-aminophenyl)-2-aminophenyl]ethanone
• CAS: 98805-29-9
• 化学式: C₁₆H₁₆N₂O₂
• 分子量: 268.31
• InChiKey: OGWSSNXNTQBRKY-UHFFFAOYSA-N

物化性质

• 沸点：
  487.3±45.0 °C(Predicted)
• 密度：
  1.206±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  2.7
• 重原子数：
  20
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.12
• 拓扑面积：
  86.2
• 氢给体数：
  2
• 氢受体数：
  4

文献信息

• Fluorinated bis(phthalic anhydride) and method for producing the same
  申请人：Masuda Go

  公开号：US20050020839A1

  公开（公告）日：2005-01-27

  It is an object of the present invention to provide fluorinated bis(phthalic anhydride) which has less coloration and higher solubility in comparison with conventional compounds, and a method for producing the same. Further, it is also an object of the present invention to provide a method for producing a fluorinated bis(phthalonitrile) compound, which is an intermediate raw material compound of the method for producing the fluorinated bis(phthalic anhydride), and a polyamic acid and a polyimide, which are produced from the fluorinated bis(phthalic anhydride). A fluorinated bis(phthalic anhydride) of the present invention is the fluorinated bis(phthalic anhydride) represented by the following formula (I 1 ), wherein its specific surface area is 3.0 m 2 /g or larger. It is also characterized in that its molar absorption coefficient is 0.6 L/mol·cm or less at a wavelength of 360 nm. [wherein, m and n independently represent integers of 1 to 3, and Z 1 represents a single bond group or a bivalent organic group.]

  本发明的目的是提供具有比传统化合物更少着色和更高溶解性的氟化双(邻苯二甲酸酐)以及其生产方法。此外，本发明还旨在提供一种用于生产氟化双(邻苯二腈)化合物的方法，该化合物是生产氟化双(邻苯二甲酸酐)的中间原料化合物，并且提供由氟化双(邻苯二甲酸酐)生产的聚酰胺酸和聚酰亚胺的方法。本发明的氟化双(邻苯二甲酸酐)是由以下式(I1)表示的氟化双(邻苯二甲酸酐)，其中其比表面积为3.0 m2/g或更大。其特征在于，在360 nm波长处，其摩尔吸光系数不超过0.6 L/mol·cm。【其中，m和n独立表示1到3的整数，Z1表示单键基团或二价有机基团。】
• Low thermal expansion resin material for a wiring insulating film.
  申请人：HITACHI, LTD.

  公开号：EP0133533A2

  公开（公告）日：1985-02-27

  A resin material comprising a polyimide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.

  一种由聚酰亚胺组成的树脂材料，其化学结构单元为至少一个芳香环，该芳香环可绕其分子轴旋转，但在另一个方向上没有柔韧性，所述聚酰亚胺至少在单轴方向上定向，具有较低的热膨胀系数，并可与无机材料塑合成一体，形成复合形状的物品。
• Electronic device comprising a polyimide layer, and method for its production
  申请人：HITACHI, LTD.

  公开号：EP0286829A2

  公开（公告）日：1988-10-19

  An electronic device having a polyimide layer (7) which is in direct or indirect contact with at least one active area (6) of the electronic device, wherein the poly­imide has, at one end of the molecule, a carboxy group attached to an aliphatic carbon atom. The polyimide layer (7) of the electronic device consists of a homogeneous insulating film improved in flatness and adhesive properties without imparing the heat resistant, mechanical properties, and electrical properties inherent in polyimides, whereby it has been possible to provide the electronic device improved in reliability and performance.

  一种具有聚酰亚胺层（7）的电子装置，该层与电子装置的至少一个有源区（6）直接或间接接触，其中聚酰亚胺分子的一端有一个连接到脂肪族碳原子上的羧基。 电子设备的聚酰亚胺层（7）由一层均匀的绝缘薄膜组成，在平整度和粘合性方面都有所改进，同时又不影响聚酰亚胺固有的耐热性、机械性能和电气性能，从而使电子设备的可靠性和性能得到提高。
• Process for producing metal-polyimide composite article
  申请人：HITACHI, LTD.

  公开号：EP0361461A2

  公开（公告）日：1990-04-04

  The present invention provides a process for producing a metal (2)-polyimide (3) composite material such as a wiring board. In production thereof, deterioration of polyamide film (3) due to oxidation during imidization of a polyimide precursor in contact with metal (2) such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.

  本发明提供了一种生产金属（2）-聚酰亚胺（3）复合材料（如线路板）的工艺。在生产过程中，可以防止聚酰亚胺前体在与铜或银等金属（2）接触的亚胺化过程中因氧化而导致聚酰胺薄膜（3）变质。本发明的特点是使用具有被掩蔽的酸性官能团的聚酰亚胺前体。聚酰胺前体的例子有聚酰胺酸环氧加合物、氨基聚酰胺酸、硅烷化聚酰胺酸等。
• Process for producing copper or silver/polyimide composite article
  申请人：HITACHI, LTD.

  公开号：EP0361462A2

  公开（公告）日：1990-04-04

  The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal (2)/polyimide (3) composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film (2) and curing it: wherein R₁ and R₂ which may be identical or different each represents an organic group of 1 or more carbon atoms.

  本发明提供了一种生产金属/聚酰亚胺复合材料制品（如高密度线路板）的工艺。这种金属（2）/聚酰亚胺（3）复合材料制品的生产方法包括在金属膜（2）上涂覆由下式表示的聚酰胺酸烷基酯并使其固化： 其中 R₁ 和 R₂ 可以相同或不同，各自代表一个或多个碳原子的有机基团。