THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS
申请人:SHIKOKU CHEMICALS CORPORATION
公开号:US20200369606A1
公开(公告)日:2020-11-26
The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).
LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF
申请人:Dershem Stephen M.
公开号:US20100063184A1
公开(公告)日:2010-03-11
The present invention is based on the discovery that certain electron poor olefins combined with nucleophiles and a base catalyst are useful as adhesive compositions for the electronic packaging industry. In particular, the adhesive formulations set forth herein are useful as low temperature curing formulations with high adhesion to a variety of substrates. Invention formulations typically cure at about 80° C. and have a potlife of about 24 hours. The formulations cure by the well-known Michael addition reaction.
MERCAPTOETHYLGLYCOL URIL COMPOUND AND UTILIZATION THEREOF
申请人:SHIKOKU CHEMICALS CORPORATION
公开号:US20180051038A1
公开(公告)日:2018-02-22
The present invention provides a novel mercaptoethylglycoluril compound. The present invention also provides a curing agent for an epoxy resin using the substance, an epoxy resin composition using the curing agent for an epoxy resin, and an adhesive and a sealing agent each using the epoxy resin composition.
An addition product obtained by reacting (a) a polyfunctional epoxy compound and (b) a compound having at least one functional group of OH group, SH group, COOH group and CONHNH2 group together with a tertiary amino group in the molecule, and an addition product obtained (a), (b) and (c) an organic compound having two or more active hydrogen atoms in the molecule (excluding a compound having an epoxy group or tertiary amino group) are good curing agents for epoxy resin. The curing agents are useful in formulating novel storable one-package, heat-curable epoxy resin-based compositions.
Polythiol epoxy resin composition with extended working life
申请人:Ajinomoto Co., Inc.
公开号:EP0594133A2
公开(公告)日:1994-04-27
An epoxy resin composition which contains (1) an epoxy resin which has 2 or more epoxy groups in its molecule, (2) a polythiol compound which has 2 or more thiol groups in its molecule and (3) a solid dispersion-type amine adduct latent curing accelerator or the product of a reaction between a compound which contains one or more isocyanate groups in its molecule and a compound which has at least one primary and/or secondary amino group in its molecule.