申请人:Asahi Kasei Chemicals Corporation
公开号:EP1867672A1
公开(公告)日:2007-12-19
To provide an epoxy resin composition that can afford a printed wiring board excellent in heat resistance, adhesiveness, prepreg storage stability, and insulation reliability.
An epoxy resin composition containing (A) an oxazolidone ring-containing epoxy resin, (B) a novolac-type epoxy resin, (C) a guanidine derivative, and (D) an imidazole as components, wherein the component (A) contains an isocyanuric ring as well as an oxazolidone ring and, the IR absorbance ratio of the isocyanuric ring to the oxazolidone ring is not less than 0.01 and not more than 0.1, the weight ratio of the component (A) to the component (B) is 5:95 to 95:5, the content of the component (C) and the content of the component (D) are 0.01 to 5 parts by weight and not more than 0.08 part by weight, respectively, based on 100 parts by weight of the total weight of the epoxy resins containing the component (A) and the component (B), and the bromine content based on a weight obtained by subtracting the weight of the component (C) and the weight of the component (D) from the weight of the resin composition is not less than 10% by weight and not more than 20% by weight.
提供一种环氧树脂组合物,它能使印刷线路板具有优异的耐热性、粘合性、预浸料贮存稳定性和绝缘可靠性。
一种环氧树脂组合物,含有 (A) 含噁唑烷酮环的环氧树脂、(B) 酚醛型环氧树脂、(C) 胍衍生物和 (D) 咪唑作为组分,其中组分 (A) 既含有异氰脲酸环,也含有噁唑烷酮环,异氰脲酸环与噁唑烷酮环的红外吸收比不小于 0.01且不大于0.1,组分(A)与组分(B)的重量比为5:95至95:5,组分(C)和组分(D)的含量为0.以含有组分(A)和组分(B)的环氧树脂总重量 100 重量份为基准,组分(C)的含量为 0.01 至 5 重量份,组分(D)的含量为不超过 0.08 重量份;以从树脂组合物重量中减去组分(C)和组分(D)的重量所得的重量为基准,溴含量不低于 10%,不超过 20%。