2,5-diethynylbenzoic acid | 1207263-08-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2,5-diethynylbenzoic acid
• CAS: 1207263-08-8
• 化学式: C₁₁H₆O₂
• 分子量: 170.167
• InChiKey: PWUPPVLAUOWBKC-UHFFFAOYSA-N

物化性质

• 熔点：
  115-116 °C
• 沸点：
  311.2±37.0 °C(Predicted)
• 密度：
  1.25±0.1 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.9
• 重原子数：
  13
• 可旋转键数：
  3
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  37.3
• 氢给体数：
  1
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  2,5-diethynylbenzoic acid 、 O-(N-succinimidyl)-N,N,N',N'-tetramethyluronium tetrafluoroborate 在 N,N-二异丙基乙胺 作用下， 以 N,N-二甲基甲酰胺 为溶剂， 反应 1.5h， 以76%的产率得到2,5-dioxopyrrolidin-1-yl 2,5-diethynylbenzoate
  参考文献：
  名称：

  Small molecule induced control in duplex and triplex DNA-directed chemical reactions

  摘要：

  三联DNA结合剂能够有效控制DNA结构中铜催化的炔-叠氮反应，从而分别发生末端连接叠氮和炔的三联DNA定向反应，无论是否存在三联DNA结合剂。

  DOI：

  10.1039/b919387a
• 作为产物：
  描述：

  methyl 2,5-diethynylbenzoate 在 甲醇 、 水 、 sodium hydroxide 作用下， 反应 2.0h， 以79%的产率得到2,5-diethynylbenzoic acid
  参考文献：
  名称：

  Small molecule induced control in duplex and triplex DNA-directed chemical reactions

  摘要：

  三联DNA结合剂能够有效控制DNA结构中铜催化的炔-叠氮反应，从而分别发生末端连接叠氮和炔的三联DNA定向反应，无论是否存在三联DNA结合剂。

  DOI：

  10.1039/b919387a

文献信息

• NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20190169211A1

  公开（公告）日：2019-06-06

  The present invention has been made in view of the circumstances herein. An object of the present invention is to provide: a tetracarboxylic dianhydride which can lead to a polyimide usable as a base resin of a photosensitive resin composition capable of forming a fine pattern and obtaining high resolution without impairing excellent characteristics such as mechanical strength and adhesiveness; a polyimide resin obtained by using the tetracarboxylic dianhydride; and a method for producing the polyimide resin. The tetracarboxylic dianhydride is shown by the following general formula (1).

  本发明是基于本文中的情况而作出的。本发明的目的是提供：一种四羧酸二酐，可导致聚酰亚胺，作为感光树脂组合物的基树脂，能够形成细微图案并获得高分辨率，同时不损害优异的特性，如机械强度和粘附性；通过使用该四羧酸二酐获得的聚酰亚胺树脂；以及生产该聚酰亚胺树脂的方法。该四羧酸二酐由以下通用式（1）所示。
• NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
  申请人：International Business Machines Corporation

  公开号：US20210317270A1

  公开（公告）日：2021-10-14

  Provided is a compound that can be used as a base resin for a photosensitive resin composition. The photosensitive resin can form a fine pattern and can achieve high resolution without impairing mechanical strength and solubility. The compound is represented by the general formula (1): wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms; X 1 to X 3 represent any of —CO 2 —, —CONR X1 —, —O—, —NR X1 —, —S—, —SO 2 —, —SO 3 — and —SO 2 NR X1 — and may be the same as or different from each other, provided that R X1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; Ar represents a divalent aromatic group having 2 to 30 carbon atoms; L 1 and L 2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms; and x and y are each independently 0 or 1.

  提供的是一种可以用作光敏树脂组合物的基树脂的化合物。这种光敏树脂可以形成精细图案，并且可以在不影响机械强度和溶解性的情况下实现高分辨率。该化合物由通式（1）表示：其中Z代表具有2到30个碳原子的线性、支链或环状二价碳氢基团；X1到X3代表任何一种—CO2—、—CONRX1—、—O—、—NRX1—、—S—、—SO2—、—SO3—和—SO2NRX1—中的一种，并且它们可以相同也可以不同，只要RX1是氢原子或具有1到30个碳原子的一价碳氢基团；Ar代表具有2到30个碳原子的二价芳香基团；L1和L2分别代表具有1到30个碳原子的二价碳氢基团；x和y分别独立地为0或1。
• TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20180120702A1

  公开（公告）日：2018-05-03

  The present invention provides a tetracarboxylic acid diester compound represented by the following general formula (1), wherein, X 1 represents a tetravalent organic group, and R 1 represents a group represented by the following general formula (2), wherein, the dotted line represents a bonding, Y 1 represents an organic group with a valency of k+1, Rs represents a group containing at least one silicon atom, “k” represents 1, 2 or 3, and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound which can lead a polymer of a polyimide precursor capable of using a base resin of a negative photosensitive resin composition which is capable of forming a fine pattern and giving high resolution, a polymer of a polyimide precursor obtained by using the tetracarboxylic acid diester compound and a method for producing the same.

  本发明提供了一种四羧酸二酯化合物，其表示为以下通式（1）：其中，X1表示四价有机基团，R1表示以下通式（2）所表示的基团：其中，虚线表示键合，Y1表示具有k+1价的有机基团，Rs表示含有至少一个硅原子的基团，“k”表示1、2或3，“n”表示0或1。可以提供一种四羧酸二酯化合物，该化合物能够引导聚合物的形成，该聚合物是由使用负光敏树脂组合物的基树脂制成的，该组合物能够形成细微图案并具有高分辨率，使用四羧酸二酯化合物制得的聚酰亚胺前体聚合物以及其制备方法。
• POLYAMIC ACID RESIN COMPOSITION AND METHOD OF PRODUCING THE SAME
  申请人：Miyazaki Daichi

  公开号：US20130289202A1

  公开（公告）日：2013-10-31

  The disclosed polyamic acid resin composition contains (a) a polyamic acid represented by general formula (1) or (2), and (b) a solvent. (A, A′, C, C′ are end-capped polyamic acid blocks comprising diaminobenzanilide and pyromellitic dianhydride or benzophenone tetracarboxylic dianhydride, and B, or D, is a polyamic acid block comprising a repeating unit other than A, A′, or C, C′. A-B-A′  (1) C-D-C′  (2)

  披露的聚酰亚胺树脂组合物包含（a）由通式（1）或（2）表示的聚酰亚胺，以及（b）溶剂。（A，A'，C，C'是端基聚酰亚胺块，包括二氨基苯酰亚胺和苯二酸酐或苯并苯酮四羧酸酐，而B或D是聚酰亚胺块，包括除A，A'，C，C'以外的重复单元。A-B-A'（1）C-D-C'（2）
• RESIN COMPOSITION AND MANUFACTURING PROCESS THEREFOR
  申请人：Miyazaki Daichi

  公开号：US20130184406A1

  公开（公告）日：2013-07-18

  A polyamic acid resin composition includes (a) a polyamic acid having structures represented by general formula (1) in an amount of at least 80% of all the repeating units and (b) a solvent. In formula (1), A is a polyamic acid block represented by general formula (2); B is a polyamic acid block represented by general formula (3); and k is a positive integer. In formula (2), Ws are divalent organic groups having two or more carbon atoms, mainly composed of divalent organic groups represented by general formula (4); Xs are tetravalent organic groups having two or more carbon atoms. In formula (3), Ys are divalent organic groups having two or more carbon atoms, exclusive of the groups represented by formula (4); Zs are tetravalent organic groups each having two or more carbon atoms, and are mainly composed of tetravalent organic groups represented by general formula (5) or (6).

  一种聚酰胺酸树脂组合物包括（a）至少占所有重复单元的80％的结构由通式（1）表示的聚酰胺酸和（b）溶剂。在公式（1）中，A是由通式（2）表示的聚酰胺酸块；B是由通式（3）表示的聚酰胺酸块；k是正整数。在公式（2）中，Ws是具有两个或更多碳原子的二价有机基团，主要由通式（4）表示的二价有机基团组成；Xs是具有两个或更多碳原子的四价有机基团。在公式（3）中，Ys是具有两个或更多碳原子的二价有机基团，不包括公式（4）表示的基团；Zs是具有两个或更多碳原子的四价有机基团，主要由通式（5）或（6）表示的四价有机基团组成。