bis[3,4-bis(phenylethynyl)phenyl]ether | 189039-68-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: bis[3,4-bis(phenylethynyl)phenyl]ether
• 英文别名: 3,3',4,4'-Tetra(phenylethynyl)diphenyl ether；Bis[3,4-bis(phenylethynyl)phenyl] ether；4-[3,4-bis(2-phenylethynyl)phenoxy]-1,2-bis(2-phenylethynyl)benzene
• CAS: 189039-68-7
• 化学式: C₄₄H₂₆O
• 分子量: 570.69
• InChiKey: WHIZDVUVJZCEGZ-UHFFFAOYSA-N

物化性质

• 沸点：
  757.2±60.0 °C(Predicted)
• 密度：
  1.26±0.1 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  11.5
• 重原子数：
  45
• 可旋转键数：
  10
• 环数：
  6.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  9.2
• 氢给体数：
  0
• 氢受体数：
  1

反应信息

• 作为产物：
  描述：

  4,4'-二羟基二苯醚 在 bis-triphenylphosphine-palladium(II) chloride 、 溴 、 三乙胺 作用下， 以 N,N-二甲基甲酰胺 为溶剂， 反应 2.5h， 生成 bis[3,4-bis(phenylethynyl)phenyl]ether
  参考文献：
  名称：

  来自双酚的聚萘网络

  摘要：

  烯二炔首先由 Bergman 研究，并且已知经过热分子内环化生成苯 1,4 双基或“脱氢芳族”中间体。 1 虽然烯二炔研究的主要推动力仍然集中在其作为抗肿瘤剂的生物活性上，2 其他人已经报道了将烯二炔用于聚合方案。3,4 Tour 详细介绍了通过取代烯二炔和 1,2-二炔基苯的热解合成线性聚（亚苯基）和聚（萘）（方案 1）。3 这项工作扩展了早期的描述 4 并揭示了伯格曼环化为详细可行的聚合反应。迄今为止，通过伯格曼环聚合制备的聚萘仅限于具有良好热稳定性的可溶性低分子量低聚物的线性体系，或具有优异热稳定性但不溶且不易加工的高分子量聚合物。3,4 此外，1,2-二炔基单体的制备通常是通过钯催化的末端炔烃与难以制备的 1, 2-二溴或-二碘芳烃。3-5 然而，我们发现双（邻二（苯基乙炔基）苯基）单体 1-4（方案 2）克服了单体合成障碍和可加工性/性能“权衡”问题与线性聚亚芳基相同。6 我们已

  DOI：

  10.1021/ja981572a

文献信息

• Bis(aniline) compounds containing multiple substituents with carbon-carbon triple-bonded groups
  申请人：Government of the United States, as represented by the Secretary of the Air Force

  公开号：US10988437B1

  公开（公告）日：2021-04-27

  The invention relates to bis(aniline) compounds containing multiple arylethynyl, alkylethynyl, ethynyl groups or their combinations, processes of making such compounds and materials comprising such compounds. Such, bis(aniline) compounds preferably comprise multiple phenylethynyl (PE) groups, i.e. 2-4 PE moieties. Such compounds are useful monomers for the preparation of polyimides, polyamides and poly(amide-imides) whose post-fabrication crosslinking chemistry (i.e. reaction temperature) can be controlled by the number of PE per repeat unit as well as finding utility in thermosetting matrix resins, 3D printable resins, and as high-carbon-content precursors to carbon-carbon composites.

  本发明涉及包含多个芳基乙炔基、烷基乙炔基、乙炔基团或其组合的二(苯胺)化合物，制造此类化合物的过程以及包含此类化合物的材料。这样的二(苯胺)化合物优选包含多个苯乙炔基(PE)团，即2-4个PE基团。这类化合物是有用的单体，用于制备聚酰亚胺、聚酰胺和聚(酰胺-亚胺)，其制品后的交联化学（即反应温度）可以通过每个重复单元中的PE数量来控制，并且还用于热固性基体树脂、3D打印树脂，以及作为高碳含量碳-碳复合材料的预聚物。
• ETHYNYL SUBSTITUTED AROMATIC COMPOUNDS, SYNTHESIS, POLYMERS AND USES THEREOF
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0854849B1

  公开（公告）日：2001-10-31
• METHOD AND DEVICE FOR HIGH DENSITY DATA STORAGE
  申请人：Duerig Urs T.

  公开号：US20110199887A1

  公开（公告）日：2011-08-18

  The present invention is directed to a method for producing a data storage medium on a surface of a substrate for storing data in the form of topographic features. The method comprises a first step wherein a crosslinking agent containing at least three alkyne groups is deposited on the surface of the substrate. In a second step the deposited cross linking agent is cured so as to obtain the data storage medium in the form of a crosslinked polymeric layer on the surface of the substrate. The invention is further directed to a data storage medium obtained by this method and a data storage device comprising this data storage medium
• Curable composition
  申请人：Giannetti Enzo

  公开号：US20120264887A1

  公开（公告）日：2012-10-18

  The invention relates to the use of 1,5-enediyne compounds of formula (I) as curing agents in polymeric systems. In particular the invention relates to a curable composition comprising a curing agent of formula (I) and a polymer suitable to be cross-linked and to the cured article obtained therefrom.
• CURABLE COMPOSITION
  申请人：SOLVAY SPECIALTY POLYMERS ITALY S.P.A.

  公开号：US20140323661A1

  公开（公告）日：2014-10-30

  The invention relates to the use of 1,5-enediyne compounds of formula (I) as curing agents in polymeric systems. In particular the invention relates to a curable composition comprising a curing agent of formula (I) and a fluorinated polymer suitable to be cross-linked and at least one fluorinated aromatic compound.