4-(9-anthracenylethynyl)phthalic anhydride | 353764-04-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 蒽
• 英文名称: 4-(9-anthracenylethynyl)phthalic anhydride
• 英文别名: 5-(2-anthracen-9-ylethynyl)-2-benzofuran-1,3-dione
• CAS: 353764-04-2
• 化学式: C₂₄H₁₂O₃
• 分子量: 348.357
• InChiKey: PIJSJHZJNKSZPN-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.8
• 重原子数：
  27
• 可旋转键数：
  2
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  43.4
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  4-溴邻苯二甲酸酐 、 三苯基膦 、 Benzene triethylamine 、 苯 在 cupric iodide 、 双三苯基磷二氯化钯 碳酸氢钠 、 丙酮 、 crude product 、 甲苯 作用下， 反应 2.0h， 以to yield 4-(9-anthracenylethynyl)phthalic anhydride (1.03 g, 73.8%) as a deep red solid的产率得到4-(9-anthracenylethynyl)phthalic anhydride
  参考文献：
  名称：

  Preparation of polyaromatic-ethynyl thermal setting agents

  摘要：

  本发明涉及新的多环芳烃-乙炔基终止材料，具有优异的机械和化学性能，适用于高性能复合材料，可以在比苯基-乙炔基终止的酰亚胺材料更低的温度下固化。

  公开号：

  US06395907B1

文献信息

• HIGH-STRENGTH TRANSPARENT POLYAMIDIMIDE AND METHOD FOR PREPARING SAME
  申请人：LG Chem, Ltd.

  公开号：EP3366726A1

  公开（公告）日：2018-08-29

  The present invention provides a polyamide-imide film which maintains transparency and has highly enhanced mechanical properties and heat resistance. The polyamide-imide shows excellent transparency, heat resistance, mechanical strength and flexibility and thus can be used in various fields such as substrates for devices, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, multi-layer flexible printed circuits (FPC), tapes, touch panels and protective films for optical disks.

  本发明提供了一种聚酰胺-酰亚胺薄膜，它既能保持透明度，又能大大提高机械性能和耐热性。这种聚酰胺-酰亚胺薄膜具有优异的透明度、耐热性、机械强度和柔韧性，因此可用于各种领域，如设备基板、显示器覆盖基板、光学薄膜、集成电路（IC）封装、粘合薄膜、多层柔性印刷电路（FPC）、胶带、触摸屏和光盘保护膜。
• POLYAMIDE-IMIDE, METHOD FOR PREPARING SAME, AND POLYAMIDE-IMIDE FILM USING SAME
  申请人：LG Chem, Ltd.

  公开号：EP3363845A1

  公开（公告）日：2018-08-22

  The present invention provides a polyamide-imide, a method for preparing same, and a polyimide film using same. The polyamide-imide film exhibits excellent transparency, heat resistance, mechanical strength and flexibility, and thus may be used in various fields such as substrates for device, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, multi-layer flexible printed circuits (FPCs), tapes, touch panels and protective films for optical discs.

  本发明提供了一种聚酰胺-酰亚胺、一种制备方法以及一种使用聚酰胺-酰亚胺的聚酰亚胺薄膜。这种聚酰胺-酰亚胺薄膜具有优异的透明度、耐热性、机械强度和柔韧性，因此可用于各种领域，如设备基板、显示器覆盖基板、光学薄膜、集成电路（IC）封装、粘合薄膜、多层柔性印刷电路（FPC）、胶带、触摸屏和光盘保护膜。
• METHOD FOR MANUFACTURING POLYIMIDE-BASED FILM AND POLYIMIDE-BASED FILM MANUFACTURED THEREBY
  申请人：Kolon Industries, Inc.

  公开号：EP3722069A1

  公开（公告）日：2020-10-14

  The present invention relates to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby and, particularly, to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.

  本发明涉及一种聚酰亚胺基薄膜的制造方法和由此制造的聚酰亚胺基薄膜，特别是涉及一种聚酰亚胺基薄膜的制造方法和由此制造的聚酰亚胺基薄膜，其中聚酰亚胺基薄膜可用作柔性电子设备的覆盖基板，因为其屈曲特性（以屈服伸长率表示）非常出色。
• EP3450482B1
  申请人：——

  公开号：EP3450482B1

  公开（公告）日：2021-03-03
• TRANSPARENT POLYIMIDE FILM HAVING IMPROVED SOLVENT RESISTANCE
  申请人：PARK Hyo Jun

  公开号：US20110082276A1

  公开（公告）日：2011-04-07

  Disclosed herein is a transparent polyimide film having improved solvent resistance, the outer form of which is not changed by swelling or dissolving even when it is immersed in a polar solvent.