申请人:Ravikiran Ramakrisha
公开号:US20060041093A1
公开(公告)日:2006-02-23
Polymeric compositions for semiconductor applications comprising 10 to 99 wt. % of norbornene-type cycloolefin monomers represented by one or more of Formulae I(a), I(b), and optionally I(c) and/or I(d), 0.0005 to 0.5 wt. % of an addition polymerization procatalyst, and optionally: up to 0.5 wt. % of a cocatalyst, up to 59 wt. % of a crosslinking monomer, up to 50 wt. % of a viscosifier, up to 20 wt. % of a thixotropic additive(s), up to 80 wt. % of a filler, up to 10 wt. % of an antioxidant, and up to 0.6 wt. % of an antioxidant synergist, the total of the components of the formulation adding up to 100%. Such formulations are mass polymerized, or cured, to form polymeric compositions that have properties desirable for a variety of specific electronic, microelectronic, optoelectronic and micro-optoelectronic applications such as die attach adhesives, underfill materials, prepreg binders, encapsulants, protective layers, and other related applications.
用于半导体应用的聚合物组合物,包含 10 至 99 wt.%的降冰片烯类环烯烃单体(由式 I(a)、I(b)和可选的 I(c) 和/或 I(d)中的一种或多种代表)、0.0005 至 0.5 wt.%的加成聚合催化剂,以及可选的:最多 0.5 wt.%的交联单体、最多 50%的增粘剂、最多 20%的触变添加剂、最多 80%的填料、最多 10%的抗氧化剂和最多 0.6%的抗氧化增效剂。此类配方经大规模聚合或固化后形成的聚合物组合物具有各种特定的电子、微电子、光电子和微光电子应用所需的性能,如芯片连接粘合剂、底部填充材料、预浸料粘合剂、封装剂、保护层和其他相关应用。