A Comparative Study of the Synthesis of 3-Substituted Catechols using an Enzymatic and a Chemoenzymatic Method
作者:V. Berberian、C. C. R. Allen、N. D. Sharma、D. R. Boyd、C. Hardacre
DOI:10.1002/adsc.200600437
日期:2007.3.5
A series of cis-dihydrodiol metabolites, available from the bacterialdioxygenase-catalysedoxidation of monosubstituted benzene substrates using Pseudomonas putida UV4 , have been converted to the corresponding catechols using both a heterogeneous catalyst (Pd/C) and a naphthalene cis-diol dehydrogenase enzyme present in whole cells of the recombinant strain Escherichia coli DH5α(pUC129: nar B). A
Procédé de perfluoroalkylation de dérivés aromatiques
申请人:RHONE-POULENC CHIMIE
公开号:EP0206951A2
公开(公告)日:1986-12-30
La présente invention concerne un procédé de perfluoroalkylation de dérivés aromatiques par réaction, dans une première étape, dudit dérivé aromatique du dioxyde de soufre et d'un métal choisi parmi le zinc, l'aluminium, le manganèse, le cadmium, le magnésium, l'étain, le fer, le nickel et le cobalt dans un solvant aprotique polaire suivie, dans une deuxième étape, par l'addition d'un bromure ou d'un iodure de perfluoroalkyle.
Mutant microorganismexpressing oxygenase, processes of degrading organic compounds and remediation of the environment, using it
申请人:CANON KABUSHIKI KAISHA
公开号:EP0730027A2
公开(公告)日:1996-09-04
A mutant microorganism capable of degrading organic compounds without any inducer,
wherein the microorganism expresses oxygenase constitutively, and is a mutant derived from a parent microorganism capable of expressing an oxygenase enzyme with an inducer, by mutagenization using a mutagen, and a process for degrading organic compounds and remedying environment using the microorganism, as well as a process for detecting a microorganism constitutively expressing oxygenase among oxygenase-inducible microorganisms.
Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus
申请人:ASAHI KASEI KABUSHIKI KAISHA
公开号:US10831101B2
公开(公告)日:2020-11-10
A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.
The present invention provides a resin composition which can result in a cured film which has chemical resistance, low stress property, and high elongation property even by a heat treatment at a low temperature.
The resin composition comprising an alkali-soluble resin (a) which contains a phenol skeleton having a crosslinking group and a phenol skeleton not having a crosslinking group and which has a weight average molecular weight in the range of 1,000 to 50,000, wherein the content ratio of the phenol skeleton having a crosslinking group to the total 100% by mole of structural units of the phenol skeleton having a crosslinking group and the phenol skeleton not having a crosslinking group is in the range of 5 to 90% by mole.