摩熵化学
数据库官网
小程序
打开微信扫一扫
首页 分子通 化学资讯 化学百科 反应查询 关于我们
请输入关键词

Acetic acid;3-methoxypropane-1,2-diol | 921597-85-5

中文名称
——
中文别名
——
英文名称
Acetic acid;3-methoxypropane-1,2-diol
英文别名
acetic acid;3-methoxypropane-1,2-diol
Acetic acid;3-methoxypropane-1,2-diol化学式
CAS
921597-85-5
化学式
C6H14O5
mdl
——
分子量
166.17
InChiKey
WLGNMJPVQDHVDT-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    -0.92
  • 重原子数:
    11
  • 可旋转键数:
    3
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    0.83
  • 拓扑面积:
    87
  • 氢给体数:
    3
  • 氢受体数:
    5

文献信息

  • POROUS CURED EPOXY RESIN
    申请人:Asahi Kasei Kabushiki Kaisha
    公开号:EP1837365A1
    公开(公告)日:2007-09-26
    A porous object comprising a three-dimensional network skeleton of a cured epoxy resin and having interconnecting pores, characterized in that the three-dimensional network skeleton forms a non-particle-aggregation type porous object constituted of a three-dimensional branched columnar structure, the proportion of aromatic-ring-derived carbon atoms to all the carbon atoms as a component of the cured epoxy resin is 0.10-0.65, and the porous object has a porosity of 20-80% and an average pore diameter of 0.5-50 µm.
    一种多孔物体,由固化环氧树脂的三维网络骨架组成,并具有相互连接的孔隙,其特征在于,三维网络骨架形成由三维支化柱状结构构成的非颗粒聚集型多孔物体,作为固化环氧树脂成分的芳香环衍生碳原子占所有碳原子的比例为 0.10-0.65,多孔物体的孔隙率为 20-80%,平均孔隙直径为 0.5-50 µm。
  • Porous Cured Epoxy Resin
    申请人:Tsujioka Norio
    公开号:US20080210626A1
    公开(公告)日:2008-09-04
    A porous object comprising a three-dimensional network skeleton of a cured epoxy resin and having interconnecting pores, characterized in that the three-dimensional network skeleton forms a non-particle-aggregation type porous object constituted of a three-dimensional branched columnar structure, the proportion of aromatic-ring-derived carbon atoms to all the carbon atoms as a component of the cured epoxy resin is 0.10-0.65, and the porous object has a porosity of 20-80% and an average pore diameter of 0.5-50 μm.
  • US8186519B2
    申请人:——
    公开号:US8186519B2
    公开(公告)日:2012-05-29
查看更多