申请人:——
公开号:US20040157039A1
公开(公告)日:2004-08-12
An insulating material comprising a cycloolefin polymer, specifically, an interlayer insulating material for a high-density assembly board having interlayer-connecting via holes at most 200 &mgr;m in diameter, comprising a cycloolefin polymer containing at least 50 mol % of a repeating unit derived from a cycloolefin monomer; a dry film formed from a curable resin composition comprising a polymer having a number average molecular weight within a range of 1,000 to 1,000,000 as measured by gel permeation chromatography, and a hardener; and a resin-attached metal foil obtained by forming a film of a cycloolefin polymer on one side of a metal foil. Laminates, multi-layer laminates and build-up multi-layer laminates making use of these materials, and production processes thereof.
一种绝缘材料,包括环氧烷基聚合物,具体地说,这是一种用于高密度组装板的层间绝缘材料,其间层连接的经孔直径最多为200微米,包括至少50摩尔%来自环氧烷基单体的重复单元的环氧烷基聚合物; 由可固化树脂组成的可干膜,其聚合物的数量平均分子量在1,000至1,000,000之间(通过凝胶渗透色谱法测量),以及硬化剂; 以及通过在金属箔的一侧形成环氧烷基聚合物膜而获得的树脂附着金属箔。利用这些材料制成的层压板,多层层压板和堆叠多层层压板以及其生产工艺。