3-tert-Butoxy-2-hydroxypropyl prop-2-enoate | 64750-81-8

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 甘油脂
• 英文名称: 3-tert-Butoxy-2-hydroxypropyl prop-2-enoate
• 英文别名: [2-hydroxy-3-[(2-methylpropan-2-yl)oxy]propyl] prop-2-enoate
• CAS: 64750-81-8
• 化学式: C₁₀H₁₈O₄
• 分子量: 202.25
• InChiKey: KXDCZERDHTYLKY-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.8
• 重原子数：
  14
• 可旋转键数：
  7
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.7
• 拓扑面积：
  55.8
• 氢给体数：
  1
• 氢受体数：
  4

文献信息

• HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
  申请人：Asahi Kasei EMD Corporation

  公开号：EP1536286A1

  公开（公告）日：2005-06-01

  Disclosed is a negative type photosensitive resin composition comprising (A) a polyamide having a photopolymerizable unsaturated double bond, (B) a monomer having a photopolymerizable unsaturated double bond, (C) a photopolymerization initiator and (D) a melamine resin.

  本发明公开了一种负型感光树脂组合物，该组合物包括：(A) 具有可进行光聚合的不饱和双键的聚酰胺；(B) 具有可进行光聚合的不饱和双键的单体；(C) 光聚合引发剂；(D) 三聚氰胺树脂。
• POLYAMIDE
  申请人：Asahi Kasei EMD Corporation

  公开号：EP1775316A1

  公开（公告）日：2007-04-18

  A polyamide having a structure represented by the chemical formula (1): wherein m and n represent an integer satisfying m≥1, n≥1, 2≤(m+n)≤150, 0.3≤m/(m+n)≤0.9, R1 and R2 represent at least one monovalent organic group containing a photopolymerizable unsaturated bond, X1 represents at least one tetravalent aromatic group, X2 represents at least one trivalent aromatic group, Y1 and Y2 represent at least one divalent organic group, and Z represents at least one monovalent organic group selected from mono-substituted amino and imido groups.

  一种聚酰胺，其结构由化学式（1）表示： 其中 m 和 n 代表满足 m≥1, n≥1, 2≤(m+n)≤150, 0.3≤m/(m+n)≤0.9、R1 和 R2 代表至少一个含有可光聚合不饱和键的一价有机基团，X1 代表至少一个四价芳香基团，X2 代表至少一个三价芳香基团，Y1 和 Y2 代表至少一个二价有机基团，Z 代表至少一个选自单取代氨基和亚氨基的一价有机基团。
• NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE
  申请人：Asahi Kasei Kabushiki Kaisha

  公开号：EP4006073A1

  公开（公告）日：2022-06-01

  To provide a negative photosensitive resin composition which exhibits satisfactory resolution even when shifts occur in focus depth, and which has satisfactory adhesion to a mold resin and exhibits a low dielectric constant; a method for producing a polyimide using the photosensitive resin composition; a method for producing a cured relief pattern; and a semiconductor device including the cured relief pattern. Disclosed is a negative photosensitive resin composition including a polyimide precursor having a structure represented by general formula (A1), (B) a photopolymerization initiator, and (C) a solvent.

  提供一种负感光树脂组合物，该组合物即使在聚焦深度发生偏移时也能表现出令人满意的分辨率，并且与模具树脂具有令人满意的粘附性，并表现出较低的介电常数；提供一种使用该感光树脂组合物生产聚酰亚胺的方法；提供一种生产固化浮雕图案的方法；以及提供一种包括固化浮雕图案的半导体器件。 本发明公开了一种阴性光敏树脂组合物，该组合物包括具有通式(A1)表示的结构的聚酰亚胺前体、(B)光聚合引发剂和(C)溶剂。
• Photosensitive resin composition, polyimide production method, and semiconductor device
  申请人：ASAHI KASEI KABUSHIKI KAISHA

  公开号：US10719016B2

  公开（公告）日：2020-07-21

  A photosensitive resin composition, ensuring that after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and a high-adhesion polyimide layer is obtained, and a polyimide using the photosensitive resin composition, can be provided. Furthermore, a semiconductor device in which after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and short circuiting or disconnection following a high-temperature storage test is unlikely to occur. A photosensitive resin composition is characterized by including a component (A) as a photosensitive polyimide precursor, and a component (B) containing a structure represented by formula (B1). (In formula (B1), Z is a sulfur or oxygen atom, and each of R1 to R4 independently represents a hydrogen atom or a monovalent organic group).

  可以提供一种光敏树脂组合物，确保在高温储存测试后，与聚酰亚胺层接触的铜层界面不易产生空洞，并获得高粘合性聚酰亚胺层，以及使用该光敏树脂组合物的聚酰亚胺。此外，还可以提供一种半导体器件，该器件在经过高温存储测试后，与聚酰亚胺层接触的铜层界面上不易产生空洞，并且在经过高温存储测试后也不易发生短路或断路。 光敏树脂组合物的特点是包括作为光敏聚酰亚胺前体的组分（A）和含有式（B1）所代表结构的组分（B）。 (在式 (B1) 中，Z 是硫原子或氧原子，R1 至 R4 各自独立地代表氢原子或一价有机基团）。
• Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus
  申请人：ASAHI KASEI KABUSHIKI KAISHA

  公开号：US10831101B2

  公开（公告）日：2020-11-10

  A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.

  一种光敏树脂组合物含有一种树脂和一种化合物，每种树脂和化合物都具有本说明书规定的结构，这种组合物提供的固化薄膜对铜线具有极佳的粘合性。