Positive resist composition and method of forming resist pattern using the same
申请人:FUJI PHOTO FILM CO., LTD.
公开号:US20040197708A1
公开(公告)日:2004-10-07
A positive resist composition comprising: (A) a fluorine atom-containing resin, wherein the resin comprises at least one group that increases a solubility of the resin in an alkali developer by the action of an acid; and (B) a sulfonium salt compound having a cation moiety, wherein the cation moiety contains at least one hydroxy group, and the sulfonium salt compound generates an acid upon irradiation with one of an actinic ray and a radiation.