A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.
一种在基底上电镀
金属的
金属电镀液和方法,其中
金属电镀液含有能防止或抑制
金属电镀液添加剂消耗的杂原子化合物。
金属电镀液添加剂可提高电镀
金属的光亮度以及电镀液的延展性、微投掷力和宏观投掷力。添加抑制杂原子有机化合物消耗的添加剂可改善电镀
金属的物理性质和电镀工艺的效率。杂原子有机化合物可包含
硫、氧或氮杂原子。