3,5-Diphenoxy-biphenyl | 16396-73-9

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二芳基庚烷
• 英文名称: 3,5-Diphenoxy-biphenyl
• 英文别名: 1,3-Diphenoxy-5-phenylbenzene
• CAS: 16396-73-9
• 化学式: C₂₄H₁₈O₂
• 分子量: 338.406
• InChiKey: XKORZNQNZIAUQK-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.6
• 重原子数：
  26
• 可旋转键数：
  5
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  18.5
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• POLYIMIDE AND POLYIMIDE FILM, PREPARED THEREFROM, FOR FLEXIBLE DISPLAY
  申请人：LG CHEM, LTD.

  公开号：US20200062904A1

  公开（公告）日：2020-02-27

  Described is a polyimide prepared from a diamine containing a spiro or cardo group in a molecule structure, wherein the dimensional stability of the polyimide can be improved at a high temperature, and thus the polyimide can provide a polyimide film useful for a flexible substrate.

  所述是一种由分子结构中含有螺环或卡多基团的二胺制备的聚酰亚胺，其中该聚酰亚胺在高温下的尺寸稳定性可以得到改善，因此该聚酰亚胺可以提供用于柔性基板的聚酰亚胺薄膜。
• DIAMINE COMPOUND, POLYIMIDE PRECURSOR USING SAME, AND POLYIMIDE FILM
  申请人：LG CHEM, LTD.

  公开号：US20210317082A1

  公开（公告）日：2021-10-14

  Disclosed is a novel diamine having a structure of comprising an intramolecular imide group, and further comprising aromatic cyclic groups linked by an ester group to both sides of the imide group. When the novel diamine is used as a polymerizable component for preparing a polyimide, a polyimide film having remarkably improved mechanical and thermal properties while maintaining optical properties can be provided.

  本发明涉及一种新型二胺，其结构包括一个分子内酰亚胺基团，并进一步包括通过酯基连接到酰亚胺基团两侧的芳香环状基团。当将该新型二胺用作聚合组分制备聚酰亚胺时，可以提供具有显著改善的机械和热性能，同时保持光学性能的聚酰亚胺薄膜。
• DIAMINE COMPOUND, AND POLYIMIDE PRECURSOR AND POLYIMIDE FILM USING SAME
  申请人：LG CHEM, LTD.

  公开号：US20220017461A1

  公开（公告）日：2022-01-20

  Disclosed is a novel diamine compound comprising a structure in which diphenyl sulfide in a molecule is bonded through an amide bond to a phenyl ring substituted with an amine group. A polyimide film prepared by polymerizing the novel diamine compound exhibits improved mechanical and thermal properties and an enhanced refractive index.

  本发明揭示了一种新的二胺化合物，其结构为分子中的二苯基硫通过酰胺键与取代有胺基的苯环结合。通过聚合所制备的聚酰亚胺薄膜表现出改善的机械和热性能以及增强的折射率。
• Modified polyimide and curable resin composition
  申请人：LG CHEM, LTD.

  公开号：US10316128B2

  公开（公告）日：2019-06-11

  The present invention relates to a modified polyimide including a terminal group represented by Formula 1: wherein D is a heat curable or photocurable functional group, R is a divalent or higher polyvalent organic group, and n is an integer of 1 or greater. The modified polyimide undergoes less reduction in transmittance and is protected from discoloration when cured. Due to these advantages, the modified polyimide can provide a highly transparent colorless polyimide film. Particularly, the modified polyimide is suitable for use in display substrates, interlayer insulating films of semiconductor devices, passivation films, buffer coat films, insulating films for multilayer printed circuit boards, insulating films of OLEDs, and protective films of thin film transistors of liquid crystal display devices. The present invention also relates to a curable composition including the modified polyimide.

  本发明涉及一种改性聚酰亚胺，包括由式 1 表示的端基： 其中 D 是热固化或光固化官能团，R 是二价或更高价的多价有机基团，n 是 1 或更大的整数。改性聚酰亚胺的透光率降低较少，固化后不会变色。由于这些优点，改性聚酰亚胺可以提供高透明度的无色聚酰亚胺薄膜。改性聚酰亚胺尤其适用于显示器基板、半导体设备的层间绝缘膜、钝化膜、缓冲涂层膜、多层印刷电路板的绝缘膜、有机发光二极管的绝缘膜以及液晶显示设备薄膜晶体管的保护膜。本发明还涉及一种包括改性聚酰亚胺的固化组合物。
• Composition for the production of polyimide film for flexible board of photoelectronic device
  申请人：LG CHEM, LTD.

  公开号：US10544266B2

  公开（公告）日：2020-01-28

  Disclosed is a polyimide precursor composition for the production of a flexible board of a photoelectronic device. The polyimide precursor composition includes a polyimide precursor derived from a diamine or acid dianhydride including a structure of Formula 1: wherein R1 to R8, m1, m2, and m3 are as defined in the specification. Also disclosed is a polyimide film produced from the polyimide precursor composition. The polyimide film is obtained by applying the precursor composition to a substrate and curing the composition. The polyimide film has high transparency and good heat resistance. In addition, the polyimide film exhibits good dimensional stability because the substrate does not undergo an increase in stress even during high-temperature heat treatment.

  本发明公开了一种用于生产光电子器件柔性电路板的聚酰亚胺前体组合物。该聚酰亚胺前体组合物包括一种聚酰亚胺前体，由包括式 1 结构的二胺或酸二酐衍生而来： 其中 R1 至 R8、m1、m2 和 m3 如说明书中所定义。还公开了一种由聚酰亚胺前体组合物制成的聚酰亚胺薄膜。该聚酰亚胺薄膜是通过将前体组合物涂在基底上并固化组合物而得到的。聚酰亚胺薄膜具有高透明度和良好的耐热性。此外，聚酰亚胺薄膜还具有良好的尺寸稳定性，因为即使在高温热处理期间，基底也不会出现应力增加的情况。