1,1'-[1,3-Phenylenedi(propane-2,2-diyl)]bis{4-[(prop-2-en-1-yl)oxy]benzene} | 142494-80-2

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二芳基庚烷
• 英文名称: 1,1'-[1,3-Phenylenedi(propane-2,2-diyl)]bis{4-[(prop-2-en-1-yl)oxy]benzene}
• 英文别名: 1,3-bis[2-(4-prop-2-enoxyphenyl)propan-2-yl]benzene
• CAS: 142494-80-2
• 化学式: C₃₀H₃₄O₂
• 分子量: 426.6
• InChiKey: WZDNIIZNEQHKIG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  8.7
• 重原子数：
  32
• 可旋转键数：
  10
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.27
• 拓扑面积：
  18.5
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• PROCESS FOR PRODUCTION OF CYCLIC POLYORGANOSILOXANE, CURING AGENT, CURABLE COMPOSITION, AND CURED PRODUCT OF THE CURABLE COMPOSITION
  申请人：Kaneka Corporation

  公开号：EP2216336A1

  公开（公告）日：2010-08-11

  An object of the invention is to provide a curing agent and a curable composition capable of forming a cured product, which is applicable for optical material and which has excellent heat and light transparency and crack resistance, and a cured product obtained by curing the same. Moreover, an object of the invention is to provide a method for producing with use of the components of the curing agent a cyclic polyorganosiloxane having a specific structure, in a selective manner and in high yield. In order to attain the objects, a curable composition including, as essential components, (A) an organic compound including at least two carbon-carbon double bonds that are reactive with a SiH group, (B) a compound having at least two SiH groups per molecule, and (C) a hydrosilylation catalyst, uses a modified polyorganosiloxane compound having at least two SiH groups per molecule as the compound having at least two SiH groups, which modified polyorganosiloxane compound is a reaction product of a specific cyclic polyorganosiloxane.

  本发明的目的是提供一种能够形成固化物的固化剂和固化组合物，该固化剂和固化组合物适用于光学材料，具有优异的耐热性、光透明度和抗裂性，以及通过固化该固化剂和固化组合物得到的固化物。此外，本发明的一个目的是提供一种方法，利用固化剂的组分以选择性的方式高产率地生产具有特定结构的环状聚有机硅氧烷。为了实现上述目的，一种可固化组合物，其基本成分包括：(A) 至少包括两个碳碳双键的有机化合物，这些碳碳双键与 SiH 基团反应；(B) 每分子至少有两个 SiH 基团的化合物；(C) 水硅化催化剂，使用每分子至少有两个 SiH 基团的改性聚有机硅氧烷化合物作为至少有两个 SiH 基团的化合物，该改性聚有机硅氧烷化合物是特定环状聚有机硅氧烷的反应产物。
• CURABLE COMPOSITION
  申请人：Ichiryu Yoshikatsu

  公开号：US20100222525A1

  公开（公告）日：2010-09-02

  Cured products constituted with conventional epoxy compounds have been disadvantageous in heat-resistant and light-resistant transparency, and crack resistance. An object of the present invention is to provide: a modified polyorganosiloxane compound having an epoxy group and/or an oxetanyl group which provides a cured product that is excellent in heat-resistant and light-resistant transparency, and crack resistance; a curable composition thereof; and a cured product obtained by curing the same. Disclosed is a modified polyorganosiloxane compound having two or more epoxy group and/or oxetanyl group in a molecule, the compound being a hydrosilylation reaction product of the following compounds: (α 1 ) an organic compound having 2 to 6 carbon-carbon double bonds reactive with a SiH group in a molecule; (β1) a linear and/or cyclic polyorganosiloxane compound having at least two SiH groups in a molecule; and (γ1) an organic compound having at least one epoxy group or oxetanyl group and one carbon-carbon double bond reactive with a SiH group in a molecule.
• MOLDED RESIN BODY FOR SURFACE-MOUNTED LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND SURFACE-MOUNTED LIGHT-EMITTING DEVICE
  申请人：KANEKA CORPORATION

  公开号：US20150008455A1

  公开（公告）日：2015-01-08

  A molded resin body for surface-mounted light-emitting device has cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 μm to 10 μm, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMS) under the conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.
• CURABLE RESIN COMPOSITION, CURABLE RESIN COMPOSITION TABLET, MOLDED BODY, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR COMPONENT AND LIGHT EMITTING DIODE
  申请人：KANEKA CORPORATION

  公开号：US20150188008A1

  公开（公告）日：2015-07-02

  The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.
• US7371462B2
  申请人：——

  公开号：US7371462B2

  公开（公告）日：2008-05-13