PHENOLIC RESIN, EPOXY RESIN, EPOXY RESIN COMPOSITION AND CURED PRODUCT OF SAME
申请人:NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
公开号:US20220056199A1
公开(公告)日:2022-02-24
Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below.
In the formula, R
1
's each represent a hydrocarbon group having 1 to 10 carbon atoms; R
2
's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R
2
's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.
[EN] PHENOLIC RESIN, EPOXY RESIN, EPOXY RESIN COMOSITION AND CURED PRODUCT OF SAME<br/>[FR] RÉSINE PHÉNOLIQUE, RÉSINE ÉPOXY, COMPOSITION DE RÉSINE ÉPOXY ET PRODUIT DURCI DE CELLE-CI<br/>[JA] フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物およびその硬化物