2-(4-methyl-pentyl)-1H-benzimidazole | 137620-54-3

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并咪唑类
• 英文名称: 2-(4-methyl-pentyl)-1H-benzimidazole
• 英文别名: 2-(4-Methyl-pentyl)-1H-benzimidazol；2-(4-methylpentyl)-1H-benzimidazole
• CAS: 137620-54-3
• 化学式: C₁₃H₁₈N₂
• 分子量: 202.299
• InChiKey: KQGVXLZFDMSVBC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.8
• 重原子数：
  15
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.46
• 拓扑面积：
  28.7
• 氢给体数：
  1
• 氢受体数：
  1

文献信息

• [EN] COMPOUNDS COMPRISING A THREE RING CORE AS PD-1/PD-L1 BLOCKERS<br/>[FR] COMPOSÉS COMPRENANT UN NOYAU À TROIS CYCLES EN TANT QUE BLOQUEURS DE PD-1/PD-L1
  申请人：RELIVE THERAPEUTICS INC

  公开号：WO2021248231A1

  公开（公告）日：2021-12-16

  The present disclosure relates to compounds of Formula (I): (I), wherein R1, R2, L1, L2, Y1, Y2, Y3, X1, Ring A, Ring B and Ring C are as defined herein, as well as to compositions comprising such compounds. The compounds and compositions may be useful for treating diseases and conditions that are amenable to treatment by blocking PD-1, PD-L1 and/or the PD-1/PD-L1 interaction, cancers, sepsis and/or autoimmune diseases.

  本公开涉及式(I)的化合物：(I)，其中R1、R2、L1、L2、Y1、Y2、Y3、X1、环A、环B和环C的定义如本文所述，以及包含这些化合物的组合物。这些化合物和组合物可能用于治疗可通过阻断PD-1、PD-L1和/或PD-1/PD-L1相互作用而治疗的疾病和病况，如癌症、败血症和/或自身免疫疾病。
• Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board
  申请人：——

  公开号：US20030141351A1

  公开（公告）日：2003-07-31

  The invention provides a water-soluble prefluxe that can solve problems with a soldering land array having a narrow spacing in that fused solder is likely to cause soldering bridges with defective soldering, a printed circuit board with its film formed thereon, and a surface treatment process for a metal in that circuit. The water-soluble preflus comprises given two different benzimidazoles compound and an iodine-based compound optionally with an amino acid, etc. The invention provides a printed circuit board with a film of that preflux formed thereon, and a surface treatment process for the metal in that circuit.

  本发明提供了一种水溶性预熔剂，它可以解决焊接地阵列间距较窄，熔化焊料容易造成焊接桥和焊接缺陷的问题，还提供了一种印刷电路板及其上形成的薄膜，以及该电路中金属的表面处理工艺。水溶性预熔剂包括给定的两种不同的苯并咪唑化合物和一种碘基化合物（可选）以及一种氨基酸等。本发明提供了一种印刷电路板，其上形成了一层该预熔剂的薄膜，以及该电路中金属的表面处理工艺。
• US6712262B2
  申请人：——

  公开号：US6712262B2

  公开（公告）日：2004-03-30