FILM FORMING COMPOSITION, INSULATING FILM, AND ELECTRONIC DEVICE
申请人:Kubo Youhei
公开号:US20090221779A1
公开(公告)日:2009-09-03
A film forming composition is provided that includes a compound represented by Formula (1) below and/or a polymer polymerized using at least a compound represented by Formula (1) below
(in Formula (1), each A
1
independently denotes a single bond, —CO—, —NR—, —O—, —SO
2
—, —CH═CH—, —C≡C—, or a group in which two or more of the above are combined, A
2
and A
4
independently denote a monovalent organic group having 1 to 10 carbons, each A
3
independently denotes a hydrogen atom or a monovalent organic group having 1 to 10 carbons but excluding a phenyl group, X denotes a tetravalent organic group having 1 to 9 carbons, R denotes a hydrogen atom or an alkyl group having 1 to 10 carbons, each m independently denotes an integer of 1 to 5, each n independently denotes an integer of 1 or more, each p independently denotes an integer of 0 to 4, and each q independently denotes an integer of 0 to 4). There are also provided a film obtained using the film forming composition and an electronic device having the film.