A shrink material is provided comprising a specific polymer and a solvent containing an anti-vanishing solvent. A pattern is formed by applying a resist composition comprising a base resin and an acid generator onto a substrate to form a resist film, exposing, developing in an organic solvent developer to form a negative resist pattern, applying the shrink material onto the pattern, and removing the excessive shrink material with an organic solvent for thereby shrinking the size of holes and/or slits in the pattern.
本发明提供了一种收缩材料,它由特定的聚合物和含有抗消失溶剂的溶剂组成。形成图案的方法是:将由基
树脂和酸发生器组成的抗蚀剂组合物涂在基材上以形成抗蚀膜,曝光,在有机溶剂显影液中显影以形成阴性抗蚀图案,将收缩材料涂在图案上,然后用有机溶剂去除过量的收缩材料,从而缩小图案中孔和/或缝隙的尺寸。