2-Methyl-acrylic acid 2-[4-(1-methyl-1-{4-[2-(2-methyl-acryloyloxy)-ethylcarbamoyloxy]-phenyl}-ethyl)-phenoxycarbonylamino]-ethyl ester | 51265-12-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2-Methyl-acrylic acid 2-[4-(1-methyl-1-{4-[2-(2-methyl-acryloyloxy)-ethylcarbamoyloxy]-phenyl}-ethyl)-phenoxycarbonylamino]-ethyl ester
• 英文别名: 2-[[4-[2-[4-[2-(2-Methylprop-2-enoyloxy)ethylcarbamoyloxy]phenyl]propan-2-yl]phenoxy]carbonylamino]ethyl 2-methylprop-2-enoate
• CAS: 51265-12-4
• 化学式: C₂₉H₃₄N₂O₈
• 分子量: 538.598
• InChiKey: UKTCBNXEIRRWOL-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.6
• 重原子数：
  39
• 可旋转键数：
  16
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.31
• 拓扑面积：
  129
• 氢给体数：
  2
• 氢受体数：
  8

反应信息

• 作为产物：
  描述：

  双酚A 、 甲基丙烯酸异氰基乙酯 在 二月桂酸二丁基锡 作用下， 以 二氯甲烷 为溶剂， 以85%的产率得到2-Methyl-acrylic acid 2-[4-(1-methyl-1-{4-[2-(2-methyl-acryloyloxy)-ethylcarbamoyloxy]-phenyl}-ethyl)-phenoxycarbonylamino]-ethyl ester
  参考文献：
  名称：

  双(9-甲基苯基-9-芴基)过氧化物的机械化学反应及其在交联聚合物中的应用

  摘要：

  机械化学反应的探索为功能材料的设计带来了新的机遇。我们合成了新型有机过氧化物机械团双（9-甲基苯基-9-芴基）过氧化物（BMPF）并检查了其机械变色特性。其机械荧光背后的机制在聚合物网络中得到阐明和利用，该网络可以在暴露于机械刺激时释放小荧光分子 9-芴酮。此外，与 BMPF 单元交联的聚合物网络能够承受高达 110 °C 的温度，而不会改变光学特性或机械强度。由于迄今为止很少记录基于有机过氧化物的机械团，这些引人入胜的结果表明 BMPF 在应力响应材料中的应用潜力巨大。

  DOI：

  10.1021/jacs.1c08533

文献信息

• Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same
  申请人：FUJIFILM Corporation

  公开号：EP2165828A1

  公开（公告）日：2010-03-24

  The present invention provides a resin composition for laser engraving, containing at least an inorganic porous material, a binder polymer, a thermopolymerization initiator and a polymerizable compound; a relief printing plate precursor for laser engraving using the same; a relief printing plate; and a method of producing the relief printing plate.

  本发明提供了一种用于激光雕刻的树脂组合物，其中至少含有一种无机多孔材料、一种粘合剂聚合物、一种热聚合引发剂和一种可聚合化合物；一种用于激光雕刻的浮雕印版前体；一种浮雕印版；以及一种生产浮雕印版的方法。
• LASER-DECOMPOSABLE RESIN COMPOSITION AND LASER-DECOMPOSABLE PATTERN-FORMING MATERIAL AND FLEXOGRAPHIC PRINTING PLATE PRECURSOR OF LASER ENGRAVING TYPE USING THE SAME
  申请人：SUGASAKI Atsushi

  公开号：US20080057437A1

  公开（公告）日：2008-03-06

  A laser-decomposable resin composition of the invention contains a polyurethane resin having a structure wherein an aromatic group is directly connected to a urethane bond.
• RESIN COMPOSITION FOR LASER ENGRAVING, RESIN PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCTION OF RELIEF PRINTING PLATE
  申请人：Sugasaki Atsushi

  公开号：US20090081414A1

  公开（公告）日：2009-03-26

  A resin composition for laser engraving contains a hydrophilic polymer and a light-to-heat conversion agent having an absorption maximum wavelength in a range of from 700 to 1,300 nm.
• Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate
  申请人：Sugasaki Atsushi

  公开号：US20090220752A1

  公开（公告）日：2009-09-03

  The invention provides a resin composition for laser engraving, having a binder polymer containing at least one of a structure unit represented by the following Formula (I) or a structure unit represented by the following Formula (II). In the Formulae, Q represents a partial structure which provides an acid group having an acid dissociation constant pKa of 0 to 20 when it is in the form of -Q-H; R 1 to R 3 each independently represent a hydrogen atom or a monovalent organic group; and A and B each independently represent a bivalent organic connecting group. The invention further provides a relief printing plate precursor having a relief forming layer containing the resin composition, a method for manufacturing a relief printing plate having crosslinking components of the relief forming layer and laser engraving the relief forming layer, and a relief printing plate formed thereby.
• ADHESIVE COMPOSITION AND ADHESIVE FILM MADE THEREFROM
  申请人：JEONG Chul Ho

  公开号：US20100197821A1

  公开（公告）日：2010-08-05

  Disclosed is an adhesive composition including a compound having a multi-functional urethane (meth)acrylate group and an adhesive film prepared by using it. The adhesive composition includes compounds represented by Chemical Formulae 1 to 3. The compound represented by Chemical Formulae 1 to 3 includes an urethane (meth)acrylate group represented by the Chemical Formula 1-1 or 1-2.