[Bis(4-aminophenyl)methyl]phosphanone | 67354-03-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: [Bis(4-aminophenyl)methyl]phosphanone
• 英文别名: 4-[(4-aminophenyl)-phosphorosomethyl]aniline
• CAS: 67354-03-4
• 化学式: C₁₃H₁₃N₂OP
• 分子量: 244.23
• InChiKey: LQFZLEHMGYXVFX-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.2
• 重原子数：
  17
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.08
• 拓扑面积：
  69.1
• 氢给体数：
  2
• 氢受体数：
  3

文献信息

• Process for producing unsaturated dicarboxylic acid imide compound
  申请人：MATSUSHITA ELECTRIC WORKS, LTD.

  公开号：EP0387381A1

  公开（公告）日：1990-09-19

  A process for producing an unsaturated di­carboxylic acid imide compound of formula (I): wherein D represents a divalent organic group having at least one carbon/carbon double bond; R¹ represents an n-­valent organic group having at least one carbon atom; and n is an integer of 1 or above, which comprises reacting an unsaturated amide acid compound of formula (II): wherein D, R¹, and n are as defined above, with an orthoester of formula (III): R²-C⁅OR³]₃      (III) wherein R² and R³, which may be the same or different, each represents a monovalent organic group having at least one carbon atom, to form an unsaturated dicarboxylic acid amide acid ester compound of formula (IV): wherein D, R¹, R³, and n are as defined above, and then imidating the compound of formula (IV).

  一种制备式（I）的不饱和二羧酸酰亚胺化合物的方法：其中D表示至少具有一个碳/碳双键的二价有机基团；R¹表示至少具有一个碳原子的n价有机基团；n为1或以上的整数；包括将式（II）的不饱和酰胺酸化合物与式（III）的正酯发生反应：R²-C⁅OR³]₃      （III），其中R²和R³，可以相同也可以不同，每个都表示至少具有一个碳原子的一价有机基团，形成式（IV）的不饱和二羧酸酰胺酸酯化合物：其中D，R¹，R³和n如上定义，然后对式（IV）的化合物进行亚胺化。
• Curable resin composition
  申请人：MITSUI TOATSU CHEMICALS, Inc.

  公开号：EP0077840A1

  公开（公告）日：1983-05-04

  Disclosed is a curable resin composition comprising a) at least one maleimide compound selected from the group consisting of N-(alkenylphenyllmaleimide derivatives, and dimers and polymers thereof and b) one or more kinds of epoxy resins, each having at least one epoxy group in the unit molecule thereof. The resin composition may contain, besides the above two components, an amino compound as a further component c). The resin composition may comprise a prepolymer of any two components among the three components a), b) and c) and the remaining component.

  本发明公开了一种可固化树脂组合物，该树脂组合物包含 a) 至少一种马来酰亚胺化合物，该化合物选自由 N-(烯基苯基)马来酰亚胺衍生物及其二聚体和聚合物组成的组，以及 b) 一种或多种环氧树脂，每种环氧树脂的单位分子中至少有一个环氧基团。除上述两种成分外，树脂组合物还可含有一种氨基化合物作为 c) 成分。树脂组合物可包括 a)、b)和 c)三种组分中任意两种组分的预聚物和其余组分。
• Thermosetting resin composition, prepolymer thereof and cured article thereof
  申请人：Hitachi, Ltd.

  公开号：EP0078039A1

  公开（公告）日：1983-05-04

  A thermosetting resin composition comprising (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds, and a prepolymer thereof obtained by subjecting the composition to a preliminary reaction with heating to the B stage can give a cured product having excellent heat resistance of class C and flexibility.

  一种热固性树脂组合物，包含(A) 至少一种二氰胺化合物和(B) 至少一种具有一个或多个不饱和键的多价亚胺，必要时还包含(C) 至少一种环氧化合物、酚类化合物和三烯丙基异氰尿酸酯化合物中的可聚合化合物，以及通过将该组合物加热至 B 阶段进行初步反应而得到的预聚物，可以得到具有 C 级优异耐热性和柔韧性的固化产品。
• Heat-resistant resin, thermosetting composition affording the same and prepolymer thereof
  申请人：HITACHI, LTD.

  公开号：EP0102052A2

  公开（公告）日：1984-03-07

  A polymer having excellent heat resistance and mechanical properties and comprising chemical structural units of the following formulae [I] and [II]: (polymer unit having an isomelamine ring) (polymer unit having a normal melamine ring) wherein A and B each represents an at least divalent organic group having at least one aromatic ring and m and n each represents a number of at least 1.

  一种具有优异耐热性和机械性能的聚合物，由下式[I]和[II]的化学结构单元组成： (具有异戊胺环的聚合物单元） (具有一个普通三聚氰胺环的聚合物单元） 其中 A 和 B 分别代表至少具有一个芳香环的二价有机基团，m 和 n 分别代表至少为 1 的数字。
• Resin encapsulated semiconductor device and process for producing the same
  申请人：HITACHI, LTD.

  公开号：EP0123262A2

  公开（公告）日：1984-10-31

  The resin encapsulated semiconductor device having improved moisture resistance and thermal stability is provided with a resin encapsulation and/or resin coating of a resin material containing isomelamine rings and melamine rings.

  树脂封装半导体器件具有更好的防潮性和热稳定性，其树脂封装和/或树脂涂层是由含有异戊胺环和三聚氰胺环的树脂材料构成的。