4,4'-bis[(3-ethyloxetan-3-yl)methoxymethyl]biphenyl | 223608-98-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4,4'-bis[(3-ethyloxetan-3-yl)methoxymethyl]biphenyl
• 英文别名: 3-Ethyl-3-[[4-[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]phenyl]methoxymethyl]oxetane
• CAS: 223608-98-8
• 化学式: C₂₆H₃₄O₄
• 分子量: 410.554
• InChiKey: DCOXQQBTTNZJBI-UHFFFAOYSA-N

物化性质

• 沸点：
  516.2±45.0 °C(Predicted)
• 密度：
  1.077±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  4.1
• 重原子数：
  30
• 可旋转键数：
  11
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.54
• 拓扑面积：
  36.9
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  4,4'-bis[(3-ethyloxetan-3-yl)methoxymethyl]biphenyl 在 ruthenium on aluminium oxide 氢气 作用下， 以 乙酸乙酯 为溶剂， 140.0 ℃ 、6.0 MPa 条件下， 反应 6.0h， 生成 trans, trans-4,4'-bis[(3-ethyloxetan-3-yl)methoxymethyl]bicyclohexyl 、 trans, cis-4,4'-bis[(3-ethyloxetan-3-yl)methoxymethyl]bicyclohexyl 、 cis, cis-4,4'-bis[(3-ethyloxetan-3-yl)methoxymethyl]bicyclohexyl
  参考文献：
  名称：

  PROCESS FOR PRODUCING ALICYCLIC OXETANE COMPOUND

  摘要：

  公开号：

  EP1719769B1

文献信息

• PHOTOCURABLE COMPOSITION, CURED PRODUCT AND OPTICAL COMPONENT USING SAME
  申请人：DAICEL CORPORATION

  公开号：US20180134838A1

  公开（公告）日：2018-05-17

  Provided is a photocurable composition which less causes resin-induced swelling of molds, allows the molds to endure more satisfactorily, and has excellent economic efficiency. This photocurable composition includes components (A), (B), (C), and (D). The component (A) is present in a content of 10 to 50 weight percent of the totality of photocurable compounds contained in the photocurable composition. The component (A) is a cycloaliphatic epoxy compound represented by Formula (a). The component (B) is an oxetane compound having a solubility parameter of 9.5 (cal/cm 3 ) 1/2 or more as determined by the Fedors' method. The component (C) is a glycidyl ether epoxy compound having a molecular weight of 250 or more. The component (D) is a photoinitiator: wherein R 1 to R 18 are each, identically or differently, selected from hydrogen, halogen, a hydrocarbon group optionally containing oxygen or halogen, and optionally substituted alkoxy; and X is selected from a single bond and a linkage group.

  提供的是一种光固化组合物，其引起模具树脂引起的膨胀较少，使模具更能承受，并具有优秀的经济效益。该光固化组合物包括组分（A），（B），（C）和（D）。组分（A）在光固化组合物中所含光固化化合物的总量的10至50重量％。组分（A）是由式（a）表示的环状脂肪族环氧化合物。组分（B）是具有由Fedors方法确定的溶解度参数为9.5（cal/cm3）1/2或更高的氧杂环丙烷化合物。组分（C）是具有分子量为250或更高的缩水甘油醚环氧化合物。组分（D）是光引发剂：其中R1到R18分别相同或不同地选择自氢，卤素，含氧或卤素的碳氢基团和可选择的取代烷氧基; X选择自单键和连接基团。
• CURABLE RESIN COMPOSITION FOR MOLDED BODIES, MOLDED BODY, AND PRODUCTION METHOD THEREOF
  申请人：Nakamura Junichi

  公开号：US20100256313A1

  公开（公告）日：2010-10-07

  The present invention provides a curable resin composition which exhibits the following properties : excellent basic performances such as heat resistance; sufficient optical characteristics such as transparency; and excellent demoldability when a molded body of the composition is demolded at the time of molding. The present invention further provides a molded body obtainable by molding the curable resin composition and a production method thereof. A curable resin composition for molded bodies, including a thermocurable resin, wherein the curable resin composition for molded bodies includes at least one compound selected from the group consisting a compound having a boiling point of 260° C. or less at one atmospheric pressure, a silicon compound having a polyoxyalkylene chain, a silicon compound having an aryl group, and a silicon compound having a polyoxyalkylene chain and an aryl group.

  本发明提供了一种可固化树脂组合物，具有以下性能：优异的基本性能，如耐热性；足够的光学特性，如透明度；以及当组合物的成型体在成型时脱模时具有优异的脱模性能。本发明还提供了一种通过成型可固化树脂组合物获得的成型体及其生产方法。一种用于成型体的可固化树脂组合物，包括热固性树脂，其中成型体的可固化树脂组合物包括以下至少一种化合物：在一大气压下沸点为260℃或以下的化合物，具有聚氧烷链的硅化合物，具有芳基的硅化合物，以及具有聚氧烷链和芳基的硅化合物。
• RESIN COMPOSITION, POLYMER, CURED FILM AND ELECTRONIC PART
  申请人：HIRO Akito

  公开号：US20130012618A1

  公开（公告）日：2013-01-10

  Provided are a resin composition capable of forming a cured film excellent in elongation properties; a polymer suitable as a component contained in the composition; a cured film formed from the composition; and an electronic part including the cured film. The resin composition includes (A) a polymer containing a structural unit represented by the formula (a1) and a structural unit represented by the formula (a2); and (F) a solvent, wherein in the formula (a1), R 1 s are each independently a hydrogen atom or hydroxyl group, provided that at least one R 1 is hydroxyl group; and R 2 is a hydrogen atom or a C1-4 alkyl group; and in the formula (a2), R 3 s are each independently a group having a cationic polymerizable group, or a hydrogen atom, provided that at least one R 3 is a group having a cationic polymerizable group; and R 4 is a hydrogen atom or a C1-4 alkyl group.

  提供了一种树脂组合物，能够形成具有良好延展性的固化膜；一种适用于组合物中的组分的聚合物；由该组合物形成的固化膜；以及包括固化膜的电子部件。该树脂组合物包括（A）含有由公式（a1）表示的结构单元和由公式（a2）表示的结构单元的聚合物；以及（F）溶剂，其中在公式（a1）中，R1分别是氢原子或羟基，但至少一个R1是羟基；R2是氢原子或C1-4烷基；在公式（a2）中，R3分别是具有阳离子聚合物化基团的基团或氢原子，但至少一个R3是具有阳离子聚合物化基团的基团；R4是氢原子或C1-4烷基。
• PHOTOSENSITIVE COMPOSITION, CURED FILM AND PRODUCTION PROCESS THEREOF, AND ELECTRONIC PART
  申请人：JSR CORPORATION

  公开号：US20140234777A1

  公开（公告）日：2014-08-21

  It is an object of the present invention to improve the curability of a resin composition and a photosensitive composition suitably employed to form e.g., a surface protecting film and an interlaminar insulating film of e.g., an electronic part, while reducing the internal stress remaining in a substrate when the composition is used to form a cured film on the substrate. The photosensitive composition includes a resin (A) having a phenolic hydroxyl group, a crosslinking agent (B1) having at least two oxazoline groups and a crosslinking agent (B2) having at least two groups represented by —CH 2 OR (wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group) and a photosensitive acid-generating agent (C).

  本发明的目的是提高树脂组合物和光敏组合物的可固化性，适用于形成电子部件的表面保护膜和层间绝缘膜等，同时在组合物用于在基板上形成固化膜时减少基板中剩余的内部应力。光敏组合物包括具有酚羟基的树脂(A)，至少具有两个噁唑烷基的交联剂(B1)，至少具有两个由—CH2OR（其中R是氢原子，具有1至10个碳原子的烷基或乙酰基）表示的基团的交联剂(B2)和光敏酸发生剂(C)。
• EPOXY COMPOUND, CURABLE COMPOSITION, CURED PRODUCT, METHOD OF PRODUCING EPOXY COMPOUND, AND REACTIVE DILUENT
  申请人：JXTG NIPPON OIL & ENERGY CORPORATION

  公开号：US20190071409A1

  公开（公告）日：2019-03-07

  The present invention discloses a monoepoxy compound represented by the following Formula (1), a curable composition containing the same, a cured product therefrom, a method of producing the monoepoxy compound, and a reactive diluent containing the monoepoxy compound. The monoepoxy compound represented by the Formula (1) is useful in that it is capable of reducing the viscosity of a curable composition containing the monoepoxy compound, while preventing a reduction in the heat resistance of the curable composition as well as a reduction in the weight of the curable composition upon curing. (In the Formula (1), R 1 to R 6 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group.)

  本发明揭示了一种由以下式（1）表示的单环氧化合物，包含该化合物的可固化组合物，由此固化产物，制备单环氧化合物的方法以及含有单环氧化合物的反应性稀释剂。式（1）表示的单环氧化合物有用之处在于，它能够减少含有单环氧化合物的可固化组合物的粘度，同时防止可固化组合物的耐热性和固化后的重量降低。（在式（1）中，R1至R6各自独立地选自氢原子、烷基和烷氧基组成的群）