Provided according to the invention are cross-linked polymers comprising an anhydride or partially hydrolyzed anhydride functionalized polymer having oligomeric polyimide cross-links, providing a polymeric composite on a molecular scale, and shaped articles made therefrom. In some embodiments the shaped articles are particularly well suited for electronics applications. The shaped articles are characterized by low CTE (coefficient of thermal expansion), low dielectric constant (Dk), low dissipation factor (Df), high strength, high modulus and high toughness.
根据本发明提供了交联聚合物,包括具有低聚聚
酰亚胺交联的酸酐或部分
水解酸酐官能化聚合物,在分子尺度上提供了聚合物复合材料,以及由其制成的成型制品。在某些实施例中,这些异型制品特别适合电子应用。异型制品具有低 CTE(热膨胀系数)、低介电常数 (Dk)、低耗散因子 (Df)、高强度、高模量和高韧性的特点。