p-(1-methylsilacyclobutyl)styrene | 3788-90-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: p-(1-methylsilacyclobutyl)styrene
• 英文别名: 1-(4-Ethenylphenyl)-1-methylsiletane
• CAS: 3788-90-7
• 化学式: C₁₂H₁₆Si
• 分子量: 188.345
• InChiKey: VFCKIEMUTJCSFM-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.02
• 重原子数：
  13
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  0
• 氢给体数：
  0
• 氢受体数：
  0

反应信息

• 作为产物：
  描述：

  对溴苯乙烯 、 1-氯-1-甲基硅杂环丁烷 在 magnesium 、 1,2-二溴乙烷 作用下， 以 四氢呋喃 为溶剂， 反应 2.0h， 以57%的产率得到p-(1-methylsilacyclobutyl)styrene
  参考文献：
  名称：

  嵌段共聚物胶束的核交联合成聚苯乙烯磺酸钠接枝纳米粒子

  摘要：

  通过嵌段共聚物胶束的核交联和随后的化学转化，合成了聚（苯乙烯磺酸钠）（polySSNa）接枝的聚合物纳米颗粒。嵌段共聚物是通过硝基氧基介导的活性自由基聚合反应合成的，聚（p -（（（1-甲基）硅烷基环丁基）苯乙烯-嵌段-聚（新戊基对苯乙烯磺酸酯）s，polySBS- b -polySSPen。R h = 15–23 nm，其中R h代表流体动力学半径），其中polySBS核和polySSPen壳在丙酮中。通过聚SBS中的硅环丁基的开环聚合来使胶束核交联。新戊基的水解提供了聚SSNa接枝的纳米颗粒。水解前颗粒的R h在丙酮中的范围为12至21 nm，而在水解后它们在水中的R h范围为50至110 nm。

  DOI：

  10.1016/j.tet.2004.05.057

文献信息

• Benzocyclobutene/vinylphenyl-introduced polycarbosilanes with low dielectric constant, high temperature performance and photopatternability
  作者：Huan Hu、Lili Liu、Zheng Li、Cuijiao Zhao、Yawen Huang、Guanjun Chang、Junxiao Yang

  DOI：10.1016/j.polymer.2015.04.028

  日期：2015.6

  With the development of microelectronic industry, low dielectric-constant insulating materials with high temperature performance and photopatternability have aroused interest. In this work, a kind of benzocyclobutene/vinylphenyl-introduced polycarbosilanes (PVBCS) were synthesized by H2PtCl6 catalyzed ring-opening copolymerization of 4-(1-methylsilacyclobutyl) benzocyclobutene (4-MSCBBCB) and 1-methyl-1-(4-vinylphenyl) silacyclobutane (1-MVPSCB). By directly introducing photo-active groups on the pendants of polycarbosilanes, the PVBCS was endowed with photopatternability without additionally using any photo-initiators or photo-crosslinkers. DSC and FTIR characterization demonstrated that the PVBCS was UV&thermally curable. The UV curing was conducted at ambient temperature and the thermally curing was performed above 200 degrees C. TGA curves of the cured PVBCS indicated that the 5% weight loss temperature is 473 degrees C, which is above the required temperature limit. The cured PVBCS also has low dielectric constant of 2.32-2.40 in the range of 1 k similar to 1 MHz. The high temperature performance and low-dielectric constant could be attributed to the polycarbosilane main-chain structure and the benzocyclobutene-based cross-linked structure. (C) 2015 Elsevier Ltd. All rights reserved.