The synthesis of arylcyanamides: a copper-catalyzed consecutive desulfurization and C–N cross-coupling strategy
作者:S. N. Murthy Boddapati、Naresh Polam、Baby Ramana Mutchu、Hari Babu Bollikolla
DOI:10.1039/c7nj03527f
日期:——
A one pot highly efficient and simple protocol for the construction of aromatic cyanamides from thioureaviadesulphurization/C–N cross coupling using a cheap, readily available and air stable copper source as a catalyst has been described.
Base-controlled copper-catalyzed multi-component cascade reactions of cyanamides, diaryliodonium triflates and propargylamine for rapid assembly of polysubstituted 2-aminoimidazoles and 2-iminoimidazoles
Copper-catalyzed three-component and four-component cascadereactions of cyanamides, dirayliodonium triflates, and propargylamine were established for the rapid construction of polysubstituted 2-aminoimidazoles and 2-iminoimidazoles using K2CO3 and pyridine as the base, respectively. Each reaction step was efficiently accelerated by copper, and 3–4 C–N bonds were constructed with excellent regioselectivities
分别以K 2 CO 3和吡啶为碱,建立了铜催化的氨腈、三氟甲磺酸二萘碘鎓和炔丙胺的三组分和四组分级联反应,用于快速构建多取代的 2-氨基咪唑和 2-亚氨基咪唑。铜有效地加速了每个反应步骤,构建了 3-4 个 C-N 键,具有出色的区域选择性和良好的产率。
PROCESS FOR PRODUCING ARYL CARBAMATES
申请人:UBE INDUSTRIES LIMITED
公开号:EP0902014A1
公开(公告)日:1999-03-17
A process for producing an aryl carbamate of a high purity at a high yield by reacting a diaryl carbonate with an amine compound having one or more hydrogen atoms bonded to the N position in the presence of carboxylic acid(s) of the following general formulae (I): R1-COOH and/or (II): R2-COOH (wherein R1 represents an alkyl or cycloalkyl group having a carbon atom at the α-position, which is bonded to only one hydrogen atom, and R2 represents an alkyl group having a carbon atom at the α-position, which is not bonded to a hydrogen atom).
PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER
申请人:TORAY INDUSTRIES, INC.
公开号:EP1909142A1
公开(公告)日:2008-04-09
The present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxy group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator. According to the present invention, it is possible to obtain a photosensitive resin composition which remarkably enhances the adhesion property with a substrate after curing without deteriorating storage stability of a solution, and does not cause peeling of a fine pattern even upon development.