2,7-biphenylenedicarboxylic acid | 69417-80-7

• 分子结构分类: 有机化合物 - 苯类化合物
• 英文名称: 2,7-biphenylenedicarboxylic acid
• 英文别名: 2,7-BPDC；biphenylene-2,7-dicarboxylic acid
• CAS: 69417-80-7
• 化学式: C₁₄H₈O₄
• 分子量: 240.215
• InChiKey: RLGRVKKAMSZUSJ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.8
• 重原子数：
  18
• 可旋转键数：
  2
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  74.6
• 氢给体数：
  2
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  N-甲基吡咯烷酮 、 水 、 2,7-biphenylenedicarboxylic acid 、 copper(II) nitrate trihydrate 以 水 为溶剂， 以32%的产率得到[Cu24(2,7-biphenylenedicarboxylate)24(1-methyl-2-pyrrolidinone)12(H2O)12]*(1-methyl-2-pyrrolidinone)52(H2O)16
  参考文献：
  名称：

  Control of Vertex Geometry, Structure Dimensionality, Functionality, and Pore Metrics in the Reticular Synthesis of Crystalline Metal−Organic Frameworks and Polyhedra

  摘要：

  Metal-organic polyhedra and frameworks (MOPS and MOFs) were prepared by linking square units M-2(CO2)(4) (M = Cu and Zn) with a variety of organic linkers designed to control the dimensionality (periodicity) and topology of the resulting structures. We describe the preparation, characterization, and crystal structures of 5 new MOPS and 11 new MOFs (termed MOP-14, -15, -17, -23, -24 and MOF-114, -115, -116, -117, -118, -119, -222, -601, -602, -603, -604) and show how their structures are related to the shape and functionality of the building blocks. The gas uptake behaviors of MOP-23 and MOF-601 to -603 are also presented as evidence that these structures have permanent porosity and rigid architectures.

  DOI：

  10.1021/ja803783c

文献信息

• MODIFIER FOR AROMATIC POLYESTER AND AROMATIC POLYESTER RESIN COMPOSITION COMPRISING THE SAME
  申请人：TABATA Masayoshi

  公开号：US20110224343A1

  公开（公告）日：2011-09-15

  The present invention provides a modifier for aromatic polyesters which enhances the melt fluidity of aromatic polyesters without a significant decrease in the heat resistance of the aromatic polyesters, and an aromatic polyester resin composition including the modifier for aromatic polyesters. The present invention relates to a modifier for aromatic polyesters comprising polyhydric phenol residues and residues of aromatic polycarboxylic acid, acid halide or acid anhydride thereof, and the modifier comprises a material having a structure composed of a first residue selected from the group consisting of divalent residues represented by Formula (I): —Ar—W 1 x —Ar— and by Formula (II): —Ar—, the first residues being bonded to two identical or different second residues selected from the group consisting of monovalent residues represented by Formula (III): and monovalent residues represented by Formula (IV): —O—C(O)—R 7 —.

  本发明提供了一种用于芳香族聚酯的改性剂，可以增强芳香族聚酯的熔融流动性，而不明显降低芳香族聚酯的耐热性，以及包括该改性剂的芳香族聚酯树脂组合物。本发明涉及一种用于芳香族聚酯的改性剂，包括多羟基酚残基和芳香族多羧酸、酸卤或其酸酐残基，该改性剂包括具有以下结构的材料：第一残基，选择自由式(I)所代表的二价残基：—Ar—W1x—Ar—和自由式(II)所代表的：—Ar—，第一残基与选择自由式(III)所代表的单价残基：和自由式(IV)所代表的单价残基：—O—C(O)—R7—的两个相同或不同的第二残基结合。
• Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device
  申请人：——

  公开号：US20020013443A1

  公开（公告）日：2002-01-31

  A precursor of a polybenzoxazole resin which comprises a crosslinking group in a molecule and has a specific structure, a polybenzoxazole resin obtained from the precursor by the condensation reaction and the crosslinking reaction, an insulating film comprising the polybenzoxazole resin and a semiconductor device comprising an insulating interlayer film in multi-layer wiring or a film for protecting surfaces which comprises the above insulating film. The precursor exhibits excellent processability due to excellent solubility in solvents and, after the ring closure, excellent heat stability in applications. The resin exhibits excellent electric, physical and mechanical properties and is advantageously used for insulating interlayer films of semiconductor devices and the like applications.

  一种聚苯并咪唑树脂的前体，其分子中包含交联基团并具有特定的结构，通过缩合反应和交联反应获得的聚苯并咪唑树脂，包括聚苯并咪唑树脂的绝缘膜以及包括上述绝缘膜的多层布线中的绝缘中间层膜或用于保护表面的膜的半导体器件。由于前体在溶剂中具有优异的溶解性，因此表现出优异的加工性能，并且在环闭后具有优异的热稳定性能，树脂表现出优异的电学、物理和机械性能，可优点地用于半导体器件的绝缘中间层膜等应用。
• Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same
  申请人：——

  公开号：US20040002572A1

  公开（公告）日：2004-01-01

  A material for an insulating film which comprises a copolymer obtained by reacting a polyamide having a specific structure and a reactive oligomer as a component forming the film; a coating varnish for an insulating film which comprises this material and an organic solvent; an insulating film which comprises a layer of a resin comprising as a main structure a polybenzoxazole which is obtained by treating the above material or the above coating varnish by heating so that condensation reaction and crosslinking reaction take place and has fine pores; and a semiconductor device which comprises an insulating interlayer film for multi-layer wiring comprising the insulating film and/or a surface protective film comprising the insulating film. Excellent electrical, thermal and mechanical properties are exhibited and a low permittivity can be achieved.

  一种绝缘薄膜材料，包括由特定结构的聚酰胺和反应性低聚物作为成膜组分所反应得到的共聚物；一种用于绝缘薄膜的涂覆清漆，包括该材料和有机溶剂；一种绝缘薄膜，包括一层树脂，其主要结构为通过热处理上述材料或上述涂覆清漆得到的聚苯并咪唑，发生缩聚反应和交联反应并具有细小孔隙；以及一种半导体器件，包括用于多层布线的绝缘中间层膜，包括上述绝缘薄膜和/或表面保护膜，包括上述绝缘薄膜。具有优异的电性能、热性能和机械性能，并且可以实现低介电常数。
• Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device
  申请人：Enoki Takashi

  公开号：US20080206548A1

  公开（公告）日：2008-08-28

  A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.

  一种苯并噁唑树脂前体，包括第一重复单元，该单元由双氨基酚化合物和二羧酸化合物反应得到，其中至少一个具有金刚烷结构；一种苯并噁唑树脂前体，进一步包括第二重复单元，该单元由不具有金刚烷结构的双氨基酚化合物和不具有金刚烷结构的二羧酸化合物反应得到；通过上述苯并噁唑树脂前体的环合反应和脱水反应得到的聚苯并噁唑树脂；由苯并噁唑树脂前体或聚苯并噁唑树脂构成的树脂膜。可以从苯并噁唑树脂前体中获得具有优异耐热性和小介电常数的聚苯并噁唑树脂和树脂膜，以及使用树脂膜的半导体器件。
• Resin Composition, Varnish, Resin Film and Semiconductor Device
  申请人：Enoki Takashi

  公开号：US20090214860A1

  公开（公告）日：2009-08-27

  Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.

  本发明公开了一种树脂组合物，包括一种苯并噁唑树脂前体，其具有通过反应双氨基酚化合物和二羧酸化合物得到的第一重复单元，以及交联剂，其中双氨基酚化合物和/或二羧酸化合物中至少有一个具有金刚烷结构。苯并噁唑树脂前体还包括通过反应不具有金刚烷结构的双氨基酚化合物和不具有金刚烷结构的二羧酸化合物得到的第二重复单元。此外，本发明还公开了一种包括该树脂组合物的树脂膜。