The present invention deals with a novel aromatic di-isoimide chemical compound that has utility as a catalyst and as a curing agent in epoxy compositions. The di-isoimide serves effectively as a thermally activated latent catalyst in epoxy curing, thereby increasing shelf life, and avoids premature cross-linking. Novel laminated articles and printed wiring boards, including encapsulated printed wiring boards are also disclosed. The composition hereof also can be used as a flame retardant in thermoplastic and thermoset polymers.
Polymide cross-linked polymer and shaped article thereof
申请人:Lin Pui-Yan
公开号:US20060041076A1
公开(公告)日:2006-02-23
Provided according to the invention are cross-linked polymers comprising an anhydride or partially hydrolyzed anhydride functionalized polymer having oligomeric polyimide cross-links, providing a polymeric composite on a molecular scale, and shaped articles made therefrom. In some embodiments the shaped articles are particularly well suited for electronics applications. The shaped articles are characterized by low CTE (coefficient of thermal expansion), low dielectric constant (Dk), low dissipation factor (Df), high strength, high modulus and high toughness.
Polyamic acid cross-linked polymer and formable composition therefrom
申请人:Lin Pui-Yan
公开号:US20060020081A1
公开(公告)日:2006-01-26
Cross-linked polymers comprising an anhydride or partially hydrolyzed anhydride functionalized polymer having oligomeric polyamic acid cross-links are provided. In solution, a polymer of the invention forms a formable gel. The formable gel is useful for forming shaped articles that are useful for electronics applications.