tris(2,6-dimethyl-4-methoxyphenyl)phosphine | 133833-73-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: tris(2,6-dimethyl-4-methoxyphenyl)phosphine
• 英文别名: Tris(4-methoxy-2,6-dimethylphenyl)phosphane
• CAS: 133833-73-5
• 化学式: C₂₇H₃₃O₃P
• 分子量: 436.531
• InChiKey: PBBAXSUGLRJHAR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.7
• 重原子数：
  31
• 可旋转键数：
  6
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  27.7
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  (4-methoxy-2,6-dimethylphenyl)magnesium bromide 在 三氯化磷 作用下， 以 四氢呋喃 为溶剂， 以59%的产率得到tris(2,6-dimethyl-4-methoxyphenyl)phosphine
  参考文献：
  名称：

  Anodic behavior of crowded triarylphosphines. ESR study of triarylphosphoniumyl radicals, Ar3P.bul.+

  摘要：

  A large number of triarylphosphines exhibiting different steric hindrance has been prepared. The pyramidalization angle alpha of these compounds was calculated with use of the MM2 force field and was shown to depend almost exclusively on the number of ortho substituents on the phenyl rings. In a series of isosteric (same alpha) phosphines, the oxidation potential correlates with the sum of the sigma+ Hammett parameters of the phenyl substituents. In the absence of oxygen, anodic oxidation of all the triarylphosphines bearing two o-methyl substituents on each phenyl ring is reversible and yields very persistent phosphoniumyl radicals. These radicals are easily detected by ESR in liquid solution and were shown to retain a pyramidal geometry that is significantly flattened compared to that of the parent phosphine.

  DOI：

  10.1021/jo00011a018

文献信息

• EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE
  申请人：Hamada Mitsuyoshi

  公开号：US20090326100A1

  公开（公告）日：2009-12-31

  The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.
• US8084130B2
  申请人：——

  公开号：US8084130B2

  公开（公告）日：2011-12-27