4,4'-methylenebis(2-amino-3,6-dimethylphenol) | 1021497-24-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4,4'-methylenebis(2-amino-3,6-dimethylphenol)
• 英文别名: 2-Amino-4-[(3-amino-4-hydroxy-2,5-dimethylphenyl)methyl]-3,6-dimethylphenol
• CAS: 1021497-24-4
• 化学式: C₁₇H₂₂N₂O₂
• 分子量: 286.374
• InChiKey: YSIZFDTUOSZSHF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.2
• 重原子数：
  21
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.29
• 拓扑面积：
  92.5
• 氢给体数：
  4
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  4,4'-methylenebis(2-nitro-3,6-dimethylphenol) 在 palladium/activated carbon 作用下， 以 四氢呋喃 为溶剂， 生成 4,4'-methylenebis(2-amino-3,6-dimethylphenol)
  参考文献：
  名称：

  BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT

  摘要：

  本发明提供了一种在两个氨基团相邻位置上具有取代基的双(氨基酚)衍生物。该双(氨基酚)衍生物用作聚酰胺树脂的原材料，用于制备正向感光树脂组合物。还提供了一种聚酰胺树脂，包括双(氨基酚)和由羧酸衍生的结构，其中双(氨基酚)在两个氨基团相邻位置上具有取代基。提供了一种正向感光树脂组合物，包括聚苯并噁唑前体树脂，即使在低温下固化，也表现出高灵敏度和高环化速率。还提供了一种正向感光树脂组合物，包括具有酰亚胺结构、酰亚胺前体结构或酰胺酸酯结构的聚酰胺树脂。该组合物表现出高灵敏度，即使在低温下固化，也能产生低吸水性的固化产物。

  公开号：

  US20100044888A1

文献信息

• Preparation of Norbornane-based PAC Ballasts
  申请人：Bell Andrew

  公开号：US20120135352A1

  公开（公告）日：2012-05-31

  Embodiments in accordance with the present invention provide for norbornane-type ballast materials, norbornane-type photoactive compounds derived from such ballast materials and alkali-soluble positive-tone polymer compositions that encompass such norbornane-type photoactive compounds and one of a PBO or PNB resin.

  本发明实施例提供了诺博烷型镇流材料，从这种镇流材料衍生出的诺博烷型光活性化合物以及包括这种诺博烷型光活性化合物和PBO或PNB树脂之一的碱溶性正向型聚合物组合物。
• BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING THE SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PROTECTIVE FILM, INTERLAYER DIELECTRIC, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT
  申请人：Sumitomo Bakelite Company, Ltd.

  公开号：EP2077291A1

  公开（公告）日：2009-07-08

  A bis(aminophenol) derivative having substituents at positions adjacent to two amino groups is provided. The bis(aminophenol) derivative is used as a raw material of a polyamide resin for a positive-tone photosensitive resin composition. A polyamide resin comprising bis(aminophenol) and a structure derived from a carboxylic acid is also provided, the bis(aminophenol) having substituents at positions adjacent to the two amino groups. A positive-tone photosensitive resin composition comprising a polybenzooxazole precursor resin, exhibiting high sensitivity and a high cyclization rate even when cured at a low temperature is provided. Also provided is a positive-tone photosensitive resin composition comprising a polyamide resin having an imide structure, an imide precursor structure, or an amide acid ester structure. The composition exhibits high sensitivity and produces a cured product having low water absorption even when cured at a low temperature:

  本发明提供了一种双（氨基苯酚）衍生物，其取代基位于两个氨基的相邻位置。双（氨基苯酚）衍生物可用作正色调感光树脂组合物聚酰胺树脂的原料。还提供了一种由双（氨基苯酚）和衍生自羧酸的结构组成的聚酰胺树脂，双（氨基苯酚）在邻近两个氨基的位置上具有取代基。本发明提供了一种包含聚苯并恶唑前体树脂的正色调光敏树脂组合物，即使在低温固化时也能表现出高灵敏度和高环化率。还提供了一种正色调感光树脂组合物，该组合物由具有亚胺结构、亚胺前体结构或酰胺酸酯结构的聚酰胺树脂组成。该组合物具有高灵敏度，即使在低温下固化，也能产生低吸水性的固化产品：
• PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME, AND DISPLAY DEVICE
  申请人：Sumitomo Bakelite Co., Ltd.

  公开号：EP2113810A1

  公开（公告）日：2009-11-04

  A photosensitive resin composition includes an alkali-soluble resin having a polybenzoxazol precursor structure or a polyimide precursor structure, or both, and a photosensitizer, the alkali-soluble resin having a ratio ([A]/[B]) of a cyclization rate [A] (%) at 250°C to a cyclization rate [B] (%) at 300°C of 0.70 or more. According to the present invention, a photosensitive resin composition which is highly sensitive and has high productivity in the manufacture of semiconductor devices, a cured film, a protective film, an insulating film, and a semiconductor device and a display device using the cured film can be provided.

  光敏树脂组合物包括具有聚苯并恶唑前体结构或聚酰亚胺前体结构或两者的碱溶性树脂和光敏剂，碱溶性树脂在250℃时的环化率[A](%)与300℃时的环化率[B](%)之比([A]/[B])为0.70或以上。根据本发明，可以提供一种在制造半导体器件时具有高灵敏度和高生产率的光敏树脂组合物、固化膜、保护膜、绝缘膜以及使用该固化膜的半导体器件和显示器件。
• POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM
  申请人：Sumitomo Bakelite Co., Ltd.

  公开号：EP2280309A1

  公开（公告）日：2011-02-02

  A positive-type photosensitive resin composition includes (A) an alkali-soluble resin, (B) a photosensitizer, and (C) a silicon compound shown by the following general formula (1). wherein R1 represents an alkylene group having 5 to 30 carbon atoms or an organic group that includes at least one aromatic ring, and R2 represents an alkyl group having 1 to 10 carbon atoms. The positive-type photosensitive resin composition exhibits excellent storage stability, produces a film that exhibits excellent adhesion to a substrate during development, and produces a cured film that exhibits excellent adhesion to a substrate after humidification.

  一种正型光敏树脂组合物包括（A）碱溶性树脂、（B）光敏剂和（C）如下通式（1）所示的硅化合物。 其中 R1 代表具有 5 至 30 个碳原子的亚烷基或至少包括一个芳香环的有机基团，R2 代表具有 1 至 10 个碳原子的烷基。正型感光树脂组合物具有极佳的储存稳定性，在显影过程中生成的薄膜与基底具有极佳的附着力，在加湿后生成的固化薄膜与基底具有极佳的附着力。
• NORBORNANE-BASED PAC BALLAST AND POSITIVE-TONE PHOTOSENSITIVE RESIN COMPOSITION ENCOMPASSING THE PAC
  申请人：Promerus, LLC

  公开号：EP2622410A1

  公开（公告）日：2013-08-07