2-Methoxy-1,3-bis-(2-methoxy-5-methyl-benzyl)-5-methyl-benzene | 32229-41-7

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二芳基庚烷
• 英文名称: 2-Methoxy-1,3-bis-(2-methoxy-5-methyl-benzyl)-5-methyl-benzene
• 英文别名: 2-Methoxy-1,3-bis[(2-methoxy-5-methylphenyl)methyl]-5-methylbenzene
• CAS: 32229-41-7
• 化学式: C₂₆H₃₀O₃
• 分子量: 390.522
• InChiKey: CDZIRSVWNANISH-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.8
• 重原子数：
  29
• 可旋转键数：
  7
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.31
• 拓扑面积：
  27.7
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING THE SAME, PATTERNING PROCESS, AND LAMINATE
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20170255097A1

  公开（公告）日：2017-09-07

  The present invention provides a positive photosensitive resin composition containing (A) a polymer compound containing a siloxane chain, the polymer compound having a repeating unit shown by the general formula (1) and a weight average molecular weight of 3,000 to 500,000, (B) a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, (C) a crosslinking agent, and (D) a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination caused on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern having a forward tapered shape without generating a scum and a footing profile in the pattern bottom and on the substrate when a widely used 2.38% TMAH aqueous solution is used as the developer.
• US8043789B2
  申请人：——

  公开号：US8043789B2

  公开（公告）日：2011-10-25