Phenylethylphosphonsaeure-phenylether | 65924-25-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Phenylethylphosphonsaeure-phenylether
• 英文别名: [Ethyl(phenyl)phosphoryl]oxybenzene
• CAS: 65924-25-6
• 化学式: C₁₄H₁₅O₂P
• 分子量: 246.246
• InChiKey: VCBCFCHHDRXHFC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.2
• 重原子数：
  17
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.14
• 拓扑面积：
  26.3
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• [EN] METAL-FREE DIRECT ARYLATION OF DIALKYL PHOSPHONATES FOR THE SYNTHESIS OF MIXED ALKYL ARYL PHOSPHONATES<br/>[FR] ARYLATION DIRECTE SANS MÉTAL DE PHOSPHONATES DE DIALKYLE POUR LA SYNTHÈSE DE PHOSPHONATES D'ARYLE ALKYLE MIXTES
  申请人：THE BOARD OF REGENTS OF THE NEVADA SYSTEM OF HIGHER EDUCATION ON BEHALF OF THE UNIV OF NEVADA LAS VE

  公开号：WO2019028391A1

  公开（公告）日：2019-02-07

  Provided herein are phosphates, thiophosphates, phosphonates, and phosphinates, methods of making same, and methods of using these compounds and methods for the generation of pharmaceutically relevant phosphate, phosphonate, and phosphinate analogs. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

  本文提供了磷酸盐、硫代磷酸盐、膦酸盐和膦酸盐，以及制备这些化合物的方法，以及使用这些化合物和用于生成与药用相关的磷酸盐、膦酸盐和膦酸盐类似物的方法。此摘要旨在作为搜索特定领域的扫描工具，并不限制本发明。
• PROCESS FOR PRODUCING POLYOXYMETHYLENE COPOLYMER
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：EP1876193A1

  公开（公告）日：2008-01-09

  The problem to be solved is to provide a process for producing a polyoxymethylene copolymer in a molding machine with a reduced generation of formaldehyde gas. In a process for continuously producing a polyoxymethylene copolymer comprising a step of melt-kneading a crude polyoxymethylene copolymer at a temperature not lower than the melting point thereof, devolatilizing under reduced pressure the formaldehyde gas generated as a decomposition product, subsequently mixing a formaldehyde scavenger containing a hydrazide compound (A) while keeping the copolymer in a molten state and immediately pelletizing the mixture, a dispersed solution obtained by slurry-dispersing said (A) in a diluent (B) having a melting point lower than temperature (Ta) which is the lower of the melting point and the decomposition temperature of (A), within a temperature range not lower than the melting point of (B) and lower than (Ta) is used as the formaldehyde scavenger.

  要解决的问题是提供一种在成型机中生产聚甲醛共聚物的工艺，该工艺可减少甲醛气体的产生。在一种连续生产聚甲醛共聚物的工艺中，包括以下步骤：在不低于熔点的温度下对粗聚甲醛共聚物进行熔融捏合，在减压下使作为分解产物产生的甲醛气体脱溶，随后在保持共聚物处于熔融状态的同时混合含有酰肼化合物（A）的甲醛清除剂，并立即对混合物进行造粒、将所述 (A) 在稀释剂 (B) 中进行浆状分散而得到的分散溶液用作甲醛清除剂，稀释剂 (B) 的熔点低于 (A) 的熔点和分解温度中较低的温度 (Ta)，温度范围不低于 (B) 的熔点且低于 (Ta)。
• Process for Producing Polyoxymethylene Copolymer
  申请人：Nagai Satoshi

  公开号：US20090062503A1

  公开（公告）日：2009-03-05

  The problem to be solved is to provide a process for producing a polyoxymethylene copolymer in a molding machine with a reduced generation of formaldehyde gas. In a process for continuously producing a polyoxymethylene copolymer comprising a step of melt-kneading a crude polyoxymethylene copolymer at a temperature not lower than the melting point thereof, devolatilizing under reduced pressure the formaldehyde gas generated as a decomposition product, subsequently mixing a formaldehyde scavenger containing a hydrazide compound (A) while keeping the copolymer in a molten state and immediately pelletizing the mixture, a dispersed solution obtained by slurry-dispersing said (A) in a diluent (B) having a melting point lower than temperature (Ta) which is the lower of the melting point and the decomposition temperature of (A), within a temperature range not lower than the melting point of (B) and lower than (Ta) is used as the formaldehyde scavenger.
• CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
  申请人：DIC Corporation

  公开号：US20150072583A1

  公开（公告）日：2015-03-12

  In the fields of printed wiring boards and circuit boards, a good glass cloth-penetrating property is exhibited and prepreg appearance is excellent. A cured product thereof exhibits good heat resistance. A phenolic resin is a phosphorus-atom-containing phenolic resin that has phosphorus-atom-containing structural portions (i) represented by structural formula (Y1) or (Y2) below and alkoxymethyl groups (ii) in an aromatic nucleus of a phenolic compound: (In structural formulae (Y1) and (Y2), R 1 to R 4 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms). A ratio of the number of the alkoxymethyl groups (ii) relative to the total number of the phosphorus-atom-containing structural portions (i) and the alkoxymethyl groups (ii) is 5 to 20%.
• US4078016A
  申请人：——

  公开号：US4078016A

  公开（公告）日：1978-03-07