3-hydroxy-2-(hydroxymethyl)-N-phenylpropanamide | 1018832-93-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3-hydroxy-2-(hydroxymethyl)-N-phenylpropanamide
• CAS: 1018832-93-3
• 化学式: C₁₀H₁₃NO₃
• 分子量: 195.218
• InChiKey: LJYFSLSKSQRVGS-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.1
• 重原子数：
  14
• 可旋转键数：
  4
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.3
• 拓扑面积：
  69.6
• 氢给体数：
  3
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  3-hydroxy-2-(hydroxymethyl)-N-phenylpropanamide 、 对甲苯磺酰氯 在 copper(II) bis(trifluoromethanesulfonate) 、 (R,R)-2,2'-异亚丙基双(4-苯基-2-恶唑啉) potassium carbonate 作用下， 以 乙酸乙酯 为溶剂， 反应 12.0h， 生成 、
  参考文献：
  名称：

  Nonenzymatic Kinetic Resolution of 3-Hydroxyalkanamides with Chiral Copper Catalyst

  摘要：

  使用三酸铜（II）和 (R,R)-PhBox [2,2′-异亚丙基双（4-苯基-2-恶唑啉）] 作为催化剂，通过苯甲酰化作用实现了 3-羟基烷酰胺的动力学解析，并具有良好至高的选择性。

  DOI：

  10.1055/s-2008-1032057

文献信息

• RESIN COMPOSITION, SHEET OBTAINED THEREFROM, LAMINATE, POWER SEMICONDUCTOR DEVICE, PLASMA PROCESSING APPARATUS, AND PROCESS FOR PRODUCING SEMICONDUCTOR
  申请人：Toray Industries, Inc.

  公开号：EP3498776A1

  公开（公告）日：2019-06-19

  A resin composition including: (A) a polyimide resin containing 60 mol% or more of a diamine residue having a structure represented by General Formula (1) below in all diamine residues; (B) a thermosetting resin; and (C) a thermally conductive filler, wherein the resin composition contains 60 parts by volume or more of the thermally conductive filler (C) in 100 parts by volume of a total of the polyimide resin (A), the thermosetting resin (B), and the thermally conductive filler (C). Provided is a resin composition capable of providing a sheet that is excellent in heat resistance and thermal conductivity, has a low elastic modulus, and is excellent in thermal responsiveness.

  一种树脂组合物，包括：(A)聚酰亚胺树脂，在所有二胺残基中含有 60 摩尔%或更多的具有下式(1)表示的结构的二胺残基；(B)热固性树脂；以及(C)导热填料，其中树脂组合物在聚酰亚胺树脂(A)、热固性树脂(B)和导热填料(C)的总体积的 100 份体积比中含有 60 份体积比或更多的导热填料(C)。本发明提供了一种树脂组合物，该树脂组合物能够提供耐热性和导热性优异、弹性模量低且热响应性优异的板材。
• Resin composition, and sheet, laminate, power semiconductor device, and plasma processing apparatus including the same, and method of producing semiconductor using the same
  申请人：Toray Industries, Inc.

  公开号：US10793718B2

  公开（公告）日：2020-10-06

  A resin composition including: (A) a polyimide resin containing 60 mol % or more of a diamine residue having a structure represented by General Formula (1) below in all diamine residues; (B) a thermosetting resin; and (C) a thermally conductive filler, wherein the resin composition contains 60 parts by volume or more of the thermally conductive filler (C) in 100 parts by volume of a total of the polyimide resin (A), the thermosetting resin (B), and the thermally conductive filler (C). Provided is a resin composition capable of providing a sheet that is excellent in heat resistance and thermal conductivity, has a low elastic modulus, and is excellent in thermal responsiveness.

  一种树脂组合物，包括：(A)聚酰亚胺树脂，在所有二胺残基中含有 60 摩尔%或更多具有下式(1)结构的二胺残基；(B)热固性树脂；以及(C)导热填料，其中树脂组合物在聚酰亚胺树脂(A)、热固性树脂(B)和导热填料(C)的总体积的 100 份体积比中含有 60 份体积比或更多的导热填料(C)。本发明提供了一种树脂组合物，该树脂组合物能够提供耐热性和导热性优异、弹性模量低且热响应性优异的板材。
• RESIN COMPOSITION, AND SHEET, LAMINATE, POWER SEMICONDUCTOR DEVICE, AND PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND METHOD OF PRODUCING SEMICONDUCTOR USING THE SAME
  申请人：Toray Industries, Inc.

  公开号：US20190345332A1

  公开（公告）日：2019-11-14

  A resin composition including: (A) a polyimide resin containing 60 mol % or more of a diamine residue having a structure represented by General Formula (1) below in all diamine residues; (B) a thermosetting resin; and (C) a thermally conductive filler, wherein the resin composition contains 60 parts by volume or more of the thermally conductive filler (C) in 100 parts by volume of a total of the polyimide resin (A), the thermosetting resin (B), and the thermally conductive filler (C). Provided is a resin composition capable of providing a sheet that is excellent in heat resistance and thermal conductivity, has a low elastic modulus, and is excellent in thermal responsiveness.