2-ethyl-1-[2]thienyl-hexan-1-ol | 857971-90-5

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 杂芳族化合物
• 英文名称: 2-ethyl-1-[2]thienyl-hexan-1-ol
• 英文别名: 2-Aethyl-1-[2]thienyl-hexan-1-ol；2-Ethyl-1-thiophen-2-ylhexan-1-ol
• CAS: 857971-90-5
• 化学式: C₁₂H₂₀OS
• 分子量: 212.356
• InChiKey: GTGYXKFNHPDGGE-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.9
• 重原子数：
  14
• 可旋转键数：
  6
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.67
• 拓扑面积：
  48.5
• 氢给体数：
  1
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  2-ethyl-1-[2]thienyl-hexan-1-ol 在 aluminum oxide 作用下， 250.0 ℃ 、6.67 kPa 条件下， 生成 2-(2-ethyl-hex-1-enyl)-thiophene
  参考文献：
  名称：

  Condensations of Aldehydes with 2-Thienyllithium, 2-Thienylsodium and 2-Thienylmagnesium Bromide

  摘要：

  DOI：

  10.1021/ja01590a053
• 作为产物：
  描述：

  2-乙基已基醛 、 magnesium,2H-thiophen-2-ide,bromide 在 乙醚 作用下， 生成 2-ethyl-1-[2]thienyl-hexan-1-ol
  参考文献：
  名称：

  Condensations of Aldehydes with 2-Thienyllithium, 2-Thienylsodium and 2-Thienylmagnesium Bromide

  摘要：

  DOI：

  10.1021/ja01590a053

文献信息

• Modified Phenolic Resin, Epoxy Resin Composition Containing the Same, and Prepreg Containing the Composition
  申请人：Abe Takaharu

  公开号：US20080044667A1

  公开（公告）日：2008-02-21

  The modified phenolic resin of the present invention has a specific structure in which a side chain of an aromatic ring having a hydroxyl group in a phenolic resin that is an alternate copolymer of a phenolic compound and a compound having a divalent connecting group, is substituted with a group represented by general formula (1-1). By using the modified phenolic resin as a hardener for epoxy resins, there are provided an epoxy resin, a composition thereof, and a cured product thereof having excellent adhesion and flame retardancy without impairing properties of conventional phenolic resins such as gel time, glass transition temperature, moisture absorption, and mechanical properties. (In the formula, R 1 represents a C 1-8 linear, branched, or cyclic hydrocarbon group.) The present invention provides an epoxy resin composition with excellent adhesion and flame retardancy in uses such as hardeners for semiconductor sealing epoxy resins, insulating materials for electrical/electronic components, and laminates (printed circuit boards). A prepreg containing a glass substrate impregnated with the epoxy resin composition, a laminate, and an electronic circuit board are also provided.
• US8053378B2
  申请人：——

  公开号：US8053378B2

  公开（公告）日：2011-11-08