Polymer for forming insulating film, composition for forming insulating film, insulating film, and electronic device having same
申请人:Sano Yohko
公开号:US08530596B2
公开(公告)日:2013-09-10
A polymer and composition useful in forming an insulating film provided with a low permittivity, a high heat resistance, and a high mechanical strength and an insulating film obtained from these and an electronic device having the same are provided. The polymer for forming an insulating film according to the present invention is characterized by being obtained by polymerizing a reactive compound represented by Formula (1). The insulating film according to the present invention is formed using a composition for forming an insulating film including that polymer, has molecular spaces having an average space size of 0.7 nm to 5 nm, and has a permittivity of 2.3 or less. The electronic device according to the present invention has the insulating film.
(wherein R1, R2, and R3 are the same or different from each other and respectively represent an organic group having a ring structure; X and Y are the same or different from each other and respectively represent an aromatic organic group having a reactive group; and n represents 0 or 1).
提供了一种用于形成具有低介电常数、高耐热性和高机械强度的绝缘膜的聚合物和组合物,以及从这些聚合物和组合物获得的绝缘膜和具有相同绝缘膜的电子设备。根据本发明,用于形成绝缘膜的聚合物的特点在于通过聚合由式(1)表示的反应性化合物得到。根据本发明,使用包括该聚合物的形成绝缘膜的组合物形成绝缘膜,具有平均空间尺寸为0.7纳米至5纳米的分子空间,并且具有介电常数为2.3或更低。根据本发明的电子设备具有绝缘膜。(其中R1、R2和R3彼此相同或不同,分别表示具有环状结构的有机基团;X和Y彼此相同或不同,分别表示具有反应性基团的芳香性有机基团;n表示0或1)。